Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode
Magnetron sputtering generally increases the temperature of the substrate placed to face the sputtering target above 40 °C because the plasmas are transported through unbalanced magnetic field lines from the sputtering target to the substrate surface. However, by using a magnetic mirror-type magnetr...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2023-02-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0138840 |
| Summary: | Magnetron sputtering generally increases the temperature of the substrate placed to face the sputtering target above 40 °C because the plasmas are transported through unbalanced magnetic field lines from the sputtering target to the substrate surface. However, by using a magnetic mirror-type magnetron cathode, we were able to suppress the temperature of the substrate temperature to the environmental temperature of less than 40 °C at a target–substrate distance of ≥50 mm with a DC input power of ≤30 W and an Ar gas pressure of ≤0.15 Pa. This was possible because the balanced magnetic field lines confined the plasmas near the sputtering target. By enabling film deposition on low heat-resistant substrates, this deposition technique for suppressing the substrate temperature may have uses in various application fields. |
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| ISSN: | 2158-3226 |