Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode
Magnetron sputtering generally increases the temperature of the substrate placed to face the sputtering target above 40 °C because the plasmas are transported through unbalanced magnetic field lines from the sputtering target to the substrate surface. However, by using a magnetic mirror-type magnetr...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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AIP Publishing LLC
2023-02-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0138840 |
| _version_ | 1811154897998970880 |
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| author | Taisei Motomura Kenshin Takemura Toshimi Nagase Nobutomo Morita Tatsuo Tabaru |
| author_facet | Taisei Motomura Kenshin Takemura Toshimi Nagase Nobutomo Morita Tatsuo Tabaru |
| author_sort | Taisei Motomura |
| collection | DOAJ |
| description | Magnetron sputtering generally increases the temperature of the substrate placed to face the sputtering target above 40 °C because the plasmas are transported through unbalanced magnetic field lines from the sputtering target to the substrate surface. However, by using a magnetic mirror-type magnetron cathode, we were able to suppress the temperature of the substrate temperature to the environmental temperature of less than 40 °C at a target–substrate distance of ≥50 mm with a DC input power of ≤30 W and an Ar gas pressure of ≤0.15 Pa. This was possible because the balanced magnetic field lines confined the plasmas near the sputtering target. By enabling film deposition on low heat-resistant substrates, this deposition technique for suppressing the substrate temperature may have uses in various application fields. |
| first_indexed | 2024-04-10T04:23:44Z |
| format | Article |
| id | doaj.art-4747f61fb4bd40d2b5779294a4625c22 |
| institution | Directory Open Access Journal |
| issn | 2158-3226 |
| language | English |
| last_indexed | 2024-04-10T04:23:44Z |
| publishDate | 2023-02-01 |
| publisher | AIP Publishing LLC |
| record_format | Article |
| series | AIP Advances |
| spelling | doaj.art-4747f61fb4bd40d2b5779294a4625c222023-03-10T17:26:21ZengAIP Publishing LLCAIP Advances2158-32262023-02-01132025153025153-510.1063/5.0138840Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathodeTaisei Motomura0Kenshin Takemura1Toshimi Nagase2Nobutomo Morita3Tatsuo Tabaru4Sensing System Research Center, National Institute of Advanced Industrial Science and Technology, 807-1 Shuku-machi, Tosu, Saga 841-0052, JapanSensing System Research Center, National Institute of Advanced Industrial Science and Technology, 807-1 Shuku-machi, Tosu, Saga 841-0052, JapanSensing System Research Center, National Institute of Advanced Industrial Science and Technology, 807-1 Shuku-machi, Tosu, Saga 841-0052, JapanSensing System Research Center, National Institute of Advanced Industrial Science and Technology, 807-1 Shuku-machi, Tosu, Saga 841-0052, JapanSensing System Research Center, National Institute of Advanced Industrial Science and Technology, 807-1 Shuku-machi, Tosu, Saga 841-0052, JapanMagnetron sputtering generally increases the temperature of the substrate placed to face the sputtering target above 40 °C because the plasmas are transported through unbalanced magnetic field lines from the sputtering target to the substrate surface. However, by using a magnetic mirror-type magnetron cathode, we were able to suppress the temperature of the substrate temperature to the environmental temperature of less than 40 °C at a target–substrate distance of ≥50 mm with a DC input power of ≤30 W and an Ar gas pressure of ≤0.15 Pa. This was possible because the balanced magnetic field lines confined the plasmas near the sputtering target. By enabling film deposition on low heat-resistant substrates, this deposition technique for suppressing the substrate temperature may have uses in various application fields.http://dx.doi.org/10.1063/5.0138840 |
| spellingShingle | Taisei Motomura Kenshin Takemura Toshimi Nagase Nobutomo Morita Tatsuo Tabaru Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode AIP Advances |
| title | Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode |
| title_full | Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode |
| title_fullStr | Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode |
| title_full_unstemmed | Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode |
| title_short | Suppression of substrate temperature in DC magnetron sputtering deposition by magnetic mirror-type magnetron cathode |
| title_sort | suppression of substrate temperature in dc magnetron sputtering deposition by magnetic mirror type magnetron cathode |
| url | http://dx.doi.org/10.1063/5.0138840 |
| work_keys_str_mv | AT taiseimotomura suppressionofsubstratetemperatureindcmagnetronsputteringdepositionbymagneticmirrortypemagnetroncathode AT kenshintakemura suppressionofsubstratetemperatureindcmagnetronsputteringdepositionbymagneticmirrortypemagnetroncathode AT toshiminagase suppressionofsubstratetemperatureindcmagnetronsputteringdepositionbymagneticmirrortypemagnetroncathode AT nobutomomorita suppressionofsubstratetemperatureindcmagnetronsputteringdepositionbymagneticmirrortypemagnetroncathode AT tatsuotabaru suppressionofsubstratetemperatureindcmagnetronsputteringdepositionbymagneticmirrortypemagnetroncathode |