Investigations of Interface Properties in Copper-Silicon Carbide Composites
This paper analyses the technological aspects of the interface formation in the copper-silicon carbide composite and its effect on the material’s microstructure and properties. Cu-SiC composites with two different volume content of ceramic reinforcement were fabricated by hot pressing (HP) and spark...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Polish Academy of Sciences
2017-06-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/amm.2017.62.issue-2/amm-2017-0200/amm-2017-0200.xml?format=INT |
| _version_ | 1818159542259679232 |
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| author | Chmielewski M. Pietrzak K. Strojny-Nędza A. Jarząbek D. Nosewicz S. |
| author_facet | Chmielewski M. Pietrzak K. Strojny-Nędza A. Jarząbek D. Nosewicz S. |
| author_sort | Chmielewski M. |
| collection | DOAJ |
| description | This paper analyses the technological aspects of the interface formation in the copper-silicon carbide composite and its effect on the material’s microstructure and properties. Cu-SiC composites with two different volume content of ceramic reinforcement were fabricated by hot pressing (HP) and spark plasma sintering (SPS) technique. In order to protect SiC surface from its decomposition, the powder was coated with a thin tungsten layer using plasma vapour deposition (PVD) method. Microstructural analyses provided by scanning electron microscopy revealed the significant differences at metal-ceramic interface. Adhesion force and fracture strength of the interface between SiC particles and copper matrix were measured. Thermal conductivity of composites was determined using laser flash method. The obtained results are discussed with reference to changes in the area of metal-ceramic boundary. |
| first_indexed | 2024-12-11T15:47:38Z |
| format | Article |
| id | doaj.art-480d4f71cd8e402b83dd07f93f086ac8 |
| institution | Directory Open Access Journal |
| issn | 2300-1909 |
| language | English |
| last_indexed | 2024-12-11T15:47:38Z |
| publishDate | 2017-06-01 |
| publisher | Polish Academy of Sciences |
| record_format | Article |
| series | Archives of Metallurgy and Materials |
| spelling | doaj.art-480d4f71cd8e402b83dd07f93f086ac82022-12-22T00:59:39ZengPolish Academy of SciencesArchives of Metallurgy and Materials2300-19092017-06-016221315131810.1515/amm-2017-0200amm-2017-0200Investigations of Interface Properties in Copper-Silicon Carbide CompositesChmielewski M.0Pietrzak K.1Strojny-Nędza A.2Jarząbek D.3Nosewicz S.4Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, PolandInstitute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, PolandInstitute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, PolandInstitute of Fundamental Technological Research Polish Academy of Sciences, 5b Pawinskiego, 02-106Warsaw, PolandInstitute of Fundamental Technological Research Polish Academy of Sciences, 5b Pawinskiego, 02-106Warsaw, PolandThis paper analyses the technological aspects of the interface formation in the copper-silicon carbide composite and its effect on the material’s microstructure and properties. Cu-SiC composites with two different volume content of ceramic reinforcement were fabricated by hot pressing (HP) and spark plasma sintering (SPS) technique. In order to protect SiC surface from its decomposition, the powder was coated with a thin tungsten layer using plasma vapour deposition (PVD) method. Microstructural analyses provided by scanning electron microscopy revealed the significant differences at metal-ceramic interface. Adhesion force and fracture strength of the interface between SiC particles and copper matrix were measured. Thermal conductivity of composites was determined using laser flash method. The obtained results are discussed with reference to changes in the area of metal-ceramic boundary.http://www.degruyter.com/view/j/amm.2017.62.issue-2/amm-2017-0200/amm-2017-0200.xml?format=INTcopper matrix compositessilicon carbideinterfacethermal conductivityadhesion |
| spellingShingle | Chmielewski M. Pietrzak K. Strojny-Nędza A. Jarząbek D. Nosewicz S. Investigations of Interface Properties in Copper-Silicon Carbide Composites Archives of Metallurgy and Materials copper matrix composites silicon carbide interface thermal conductivity adhesion |
| title | Investigations of Interface Properties in Copper-Silicon Carbide Composites |
| title_full | Investigations of Interface Properties in Copper-Silicon Carbide Composites |
| title_fullStr | Investigations of Interface Properties in Copper-Silicon Carbide Composites |
| title_full_unstemmed | Investigations of Interface Properties in Copper-Silicon Carbide Composites |
| title_short | Investigations of Interface Properties in Copper-Silicon Carbide Composites |
| title_sort | investigations of interface properties in copper silicon carbide composites |
| topic | copper matrix composites silicon carbide interface thermal conductivity adhesion |
| url | http://www.degruyter.com/view/j/amm.2017.62.issue-2/amm-2017-0200/amm-2017-0200.xml?format=INT |
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