Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Ex...

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Bibliographic Details
Main Authors: Hongpeng Jiang, Guangqiang Yan, Jianwei Li, Jie Xu, Debin Shan, Bin Guo
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Materials
Subjects:
T-shape upsetting test
micro-forming
equal-channel angular pressing
ultrafine grains
pure copper
Online Access:https://www.mdpi.com/1996-1944/14/17/4869

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