Towards Embroidered Circuit Board From Conductive Yarns for E-Textiles
In this study, polymeric/metallic yarns were fabricated by using the micrometric copper multifilament and the polymer multifilament to create electrically conductive, thin, flexible composite yarn structures. The main aim is to realize the circuit board by using fabricated conductive yarns in the ne...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2020-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9174713/ |