Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible Substrates
Electrical conductivity is a key factor in measuring performance of printed electronics, but the conductivity of inkjet-printed silver nanoinks greatly depends on post-fabrication sintering. In this work, two different conductive silver nanoinks, in which the silver nanoparticles were stabilized by...
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Format: | Article |
Language: | English |
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Croatian Society of Chemical Engineers
2019-10-01
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Series: | Chemical and Biochemical Engineering Quarterly |
Subjects: | |
Online Access: | http://silverstripe.fkit.hr/cabeq/assets/Uploads/07-3-19.pdf |
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author | I. Ivanišević P. Kassal A. Milinković A. Rogina S. Milardović |
author_facet | I. Ivanišević P. Kassal A. Milinković A. Rogina S. Milardović |
author_sort | I. Ivanišević |
collection | DOAJ |
description | Electrical conductivity is a key factor in measuring performance of printed electronics, but the conductivity of inkjet-printed silver nanoinks greatly depends on post-fabrication sintering. In this work, two different conductive silver nanoinks, in which the silver nanoparticles were stabilized by two different capping agents – Poly(acrylic acid) (PAA) and Poly(methacrylic acid) (PMA) – were synthesized. The inks were inkjet-printed on flexible PET substrates, coated with an additional polycation layer, which facilitated chemical sintering. The printed features were then exposed to moderately elevated temperatures to evaluate the effect of combined chemical and thermal sintering. Both inks produced conductive features at room temperature, and the conductivity increased with both temperature and duration of sintering. At temperatures above 100 °C, the
choice of capping agent had no pronounced effect on conductivity, which approached very high values of 50 % of bulk silver in all cases. The lowest resistivity (2.24 μΩ cm) was obtained after sintering at 120 °C for 180 min. By combining chemical and conventional thermal sintering, we have produced remarkably conductive silver electrodes on flexible substrates, while using low-cost and simple processes. |
first_indexed | 2024-12-10T07:50:47Z |
format | Article |
id | doaj.art-4abe47b157fb425198b55c9a6c659d41 |
institution | Directory Open Access Journal |
issn | 0352-9568 1846-5153 |
language | English |
last_indexed | 2024-12-10T07:50:47Z |
publishDate | 2019-10-01 |
publisher | Croatian Society of Chemical Engineers |
record_format | Article |
series | Chemical and Biochemical Engineering Quarterly |
spelling | doaj.art-4abe47b157fb425198b55c9a6c659d412022-12-22T01:57:02ZengCroatian Society of Chemical EngineersChemical and Biochemical Engineering Quarterly0352-95681846-51532019-10-0133337738410.15255/CABEQ.2019.1585Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible SubstratesI. Ivanišević0P. Kassal1A. Milinković2A. Rogina3S. Milardović4Faculty of Chemical Engineering and Technology, University of Zagreb, Zagreb, CroatiaFaculty of Chemical Engineering and Technology, University of Zagreb, Zagreb, CroatiaFaculty of Chemical Engineering and Technology, University of Zagreb, Zagreb, CroatiaFaculty of Chemical Engineering and Technology, University of Zagreb, Zagreb, CroatiaFaculty of Chemical Engineering and Technology, University of Zagreb, Zagreb, CroatiaElectrical conductivity is a key factor in measuring performance of printed electronics, but the conductivity of inkjet-printed silver nanoinks greatly depends on post-fabrication sintering. In this work, two different conductive silver nanoinks, in which the silver nanoparticles were stabilized by two different capping agents – Poly(acrylic acid) (PAA) and Poly(methacrylic acid) (PMA) – were synthesized. The inks were inkjet-printed on flexible PET substrates, coated with an additional polycation layer, which facilitated chemical sintering. The printed features were then exposed to moderately elevated temperatures to evaluate the effect of combined chemical and thermal sintering. Both inks produced conductive features at room temperature, and the conductivity increased with both temperature and duration of sintering. At temperatures above 100 °C, the choice of capping agent had no pronounced effect on conductivity, which approached very high values of 50 % of bulk silver in all cases. The lowest resistivity (2.24 μΩ cm) was obtained after sintering at 120 °C for 180 min. By combining chemical and conventional thermal sintering, we have produced remarkably conductive silver electrodes on flexible substrates, while using low-cost and simple processes.http://silverstripe.fkit.hr/cabeq/assets/Uploads/07-3-19.pdfconductive inksilver nanoparticlesinkjet printingsinteringprinted electronics |
spellingShingle | I. Ivanišević P. Kassal A. Milinković A. Rogina S. Milardović Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible Substrates Chemical and Biochemical Engineering Quarterly conductive ink silver nanoparticles inkjet printing sintering printed electronics |
title | Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible Substrates |
title_full | Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible Substrates |
title_fullStr | Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible Substrates |
title_full_unstemmed | Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible Substrates |
title_short | Combined Chemical and Thermal Sintering for High Conductivity Inkjet-printed Silver Nanoink on Flexible Substrates |
title_sort | combined chemical and thermal sintering for high conductivity inkjet printed silver nanoink on flexible substrates |
topic | conductive ink silver nanoparticles inkjet printing sintering printed electronics |
url | http://silverstripe.fkit.hr/cabeq/assets/Uploads/07-3-19.pdf |
work_keys_str_mv | AT iivanisevic combinedchemicalandthermalsinteringforhighconductivityinkjetprintedsilvernanoinkonflexiblesubstrates AT pkassal combinedchemicalandthermalsinteringforhighconductivityinkjetprintedsilvernanoinkonflexiblesubstrates AT amilinkovic combinedchemicalandthermalsinteringforhighconductivityinkjetprintedsilvernanoinkonflexiblesubstrates AT arogina combinedchemicalandthermalsinteringforhighconductivityinkjetprintedsilvernanoinkonflexiblesubstrates AT smilardovic combinedchemicalandthermalsinteringforhighconductivityinkjetprintedsilvernanoinkonflexiblesubstrates |