Mass analysis of the components separated from printed circuit boards

Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time.The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thispurpose we analyzed weight ratio of the electr...

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Main Authors: Hana Charvátová, Dagmar Janáčová, Miloslav Fialka, Karel Kolomazník
Format: Article
Language:English
Published: Technical University of Kosice 2010-06-01
Series:Acta Montanistica Slovaca
Subjects:
Online Access:http://actamont.tuke.sk/pdf/2010/n1/12charvatova.pdf
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author Hana Charvátová
Dagmar Janáčová
Miloslav Fialka
Karel Kolomazník
author_facet Hana Charvátová
Dagmar Janáčová
Miloslav Fialka
Karel Kolomazník
author_sort Hana Charvátová
collection DOAJ
description Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time.The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thispurpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulatedmathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plasticelements. We present the obtained results in this paper.
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spelling doaj.art-4af61f3dbb0f4a879a532471884b70922022-12-21T20:55:44ZengTechnical University of KosiceActa Montanistica Slovaca1335-17882010-06-011515861Mass analysis of the components separated from printed circuit boardsHana CharvátováDagmar JanáčováMiloslav FialkaKarel KolomazníkMethods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time.The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thispurpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulatedmathematic model of temperature field in PCB during a grinding process in that the metal layers are separated from the plasticelements. We present the obtained results in this paper.http://actamont.tuke.sk/pdf/2010/n1/12charvatova.pdfMass analysisprinted circuit boardelectronic componentsrecyclingmodel
spellingShingle Hana Charvátová
Dagmar Janáčová
Miloslav Fialka
Karel Kolomazník
Mass analysis of the components separated from printed circuit boards
Acta Montanistica Slovaca
Mass analysis
printed circuit board
electronic components
recycling
model
title Mass analysis of the components separated from printed circuit boards
title_full Mass analysis of the components separated from printed circuit boards
title_fullStr Mass analysis of the components separated from printed circuit boards
title_full_unstemmed Mass analysis of the components separated from printed circuit boards
title_short Mass analysis of the components separated from printed circuit boards
title_sort mass analysis of the components separated from printed circuit boards
topic Mass analysis
printed circuit board
electronic components
recycling
model
url http://actamont.tuke.sk/pdf/2010/n1/12charvatova.pdf
work_keys_str_mv AT hanacharvatova massanalysisofthecomponentsseparatedfromprintedcircuitboards
AT dagmarjanacova massanalysisofthecomponentsseparatedfromprintedcircuitboards
AT miloslavfialka massanalysisofthecomponentsseparatedfromprintedcircuitboards
AT karelkolomaznik massanalysisofthecomponentsseparatedfromprintedcircuitboards