Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting
While the deformation behavior of grain boundaries has a strong impact on the mechanical response of polycrystalline materials, investigating the coupled thermal–mechanical properties of grain boundaries in their real formats is crucial for enhancing the ductile machinability of hard brittle polycry...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2022-11-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127522008723 |
| _version_ | 1811334060780290048 |
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| author | Liang Zhao Jianguo Zhang Yufan Fu Junjie Zhang Alexander Hartmaier Tao Sun |
| author_facet | Liang Zhao Jianguo Zhang Yufan Fu Junjie Zhang Alexander Hartmaier Tao Sun |
| author_sort | Liang Zhao |
| collection | DOAJ |
| description | While the deformation behavior of grain boundaries has a strong impact on the mechanical response of polycrystalline materials, investigating the coupled thermal–mechanical properties of grain boundaries in their real formats is crucial for enhancing the ductile machinability of hard brittle polycrystalline ceramic materials. In the present work, we report the thermal softening-suppressed inter-granular fracture, accompanied with enhanced stacking fault formation, increased healing ability of grain boundaries and promoted ductile material removal, in diamond cutting of polycrystalline 3C-SiC at elevated temperatures by multi-scale simulations. Molecular dynamics simulations and experiments of high temperature nanoindentations are performed to derive the temperature-dependent mechanical properties of bulk polycrystalline 3C-SiC. Furthermore, molecular dynamics simulations of Mode I (tension) and Mode II (shearing) loading of a Σ9<110>{122} symmetric tilt grain boundary at elevated temperatures are performed to extract the temperature-dependent mechanical properties of grain boundaries in polycrystalline 3C-SiC. A novel finite element model of heat treatment-assisted diamond cutting of polycrystalline 3C-SiC with the comprehensive consideration of thermal properties of both grains and grain boundaries at elevated temperatures is established to reveal the transition of material removal mode, grain boundary failure behavior, cutting force characteristics and chip profile with temperature. |
| first_indexed | 2024-04-13T17:02:10Z |
| format | Article |
| id | doaj.art-4b5b96a1c90f4b14b3a7ac7f9f002012 |
| institution | Directory Open Access Journal |
| issn | 0264-1275 |
| language | English |
| last_indexed | 2024-04-13T17:02:10Z |
| publishDate | 2022-11-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj.art-4b5b96a1c90f4b14b3a7ac7f9f0020122022-12-22T02:38:36ZengElsevierMaterials & Design0264-12752022-11-01223111250Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cuttingLiang Zhao0Jianguo Zhang1Yufan Fu2Junjie Zhang3Alexander Hartmaier4Tao Sun5Center for Precision Engineering, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China; Corresponding authors.State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, ChinaCenter for Precision Engineering, Harbin Institute of Technology, Harbin 150001, China; Corresponding authors.Interdisciplinary Centre for Advanced Materials Simulation, Ruhr-University Bochum, Bochum 44801, GermanyCenter for Precision Engineering, Harbin Institute of Technology, Harbin 150001, ChinaWhile the deformation behavior of grain boundaries has a strong impact on the mechanical response of polycrystalline materials, investigating the coupled thermal–mechanical properties of grain boundaries in their real formats is crucial for enhancing the ductile machinability of hard brittle polycrystalline ceramic materials. In the present work, we report the thermal softening-suppressed inter-granular fracture, accompanied with enhanced stacking fault formation, increased healing ability of grain boundaries and promoted ductile material removal, in diamond cutting of polycrystalline 3C-SiC at elevated temperatures by multi-scale simulations. Molecular dynamics simulations and experiments of high temperature nanoindentations are performed to derive the temperature-dependent mechanical properties of bulk polycrystalline 3C-SiC. Furthermore, molecular dynamics simulations of Mode I (tension) and Mode II (shearing) loading of a Σ9<110>{122} symmetric tilt grain boundary at elevated temperatures are performed to extract the temperature-dependent mechanical properties of grain boundaries in polycrystalline 3C-SiC. A novel finite element model of heat treatment-assisted diamond cutting of polycrystalline 3C-SiC with the comprehensive consideration of thermal properties of both grains and grain boundaries at elevated temperatures is established to reveal the transition of material removal mode, grain boundary failure behavior, cutting force characteristics and chip profile with temperature.http://www.sciencedirect.com/science/article/pii/S0264127522008723Polycrystalline 3C-SiCInter-granular fractureHeat treatmentTemperature-dependent propertiesFinite element simulation |
| spellingShingle | Liang Zhao Jianguo Zhang Yufan Fu Junjie Zhang Alexander Hartmaier Tao Sun Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting Materials & Design Polycrystalline 3C-SiC Inter-granular fracture Heat treatment Temperature-dependent properties Finite element simulation |
| title | Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting |
| title_full | Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting |
| title_fullStr | Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting |
| title_full_unstemmed | Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting |
| title_short | Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting |
| title_sort | thermal softening suppressed inter granular embrittlement of polycrystalline 3c sic under diamond cutting |
| topic | Polycrystalline 3C-SiC Inter-granular fracture Heat treatment Temperature-dependent properties Finite element simulation |
| url | http://www.sciencedirect.com/science/article/pii/S0264127522008723 |
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