Simultaneously realizing thermal and electromagnetic cloaking by multi-physical null medium

Simultaneously manipulating multiple physical fields plays an important role in the increasingly complex integrated systems, aerospace equipment, biochemical productions, etc. For on-chip systems with high integration level, the precise and efficient control of the propagation of electromagnetic wav...

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Bibliographic Details
Main Authors: Yichao Liu, Xiaomin Ma, Kun Chao, Fei Sun, Zihao Chen, Jinyuan Shan, Hanchuan Chen, Gang Zhao, Shaojie Chen
Format: Article
Language:English
Published: Editorial Office of Opto-Electronic Journals, Institute of Optics and Electronics, CAS, China 2024-02-01
Series:Opto-Electronic Science
Subjects:
Online Access:https://www.oejournal.org/article/doi/10.29026/oes.2024.230027
Description
Summary:Simultaneously manipulating multiple physical fields plays an important role in the increasingly complex integrated systems, aerospace equipment, biochemical productions, etc. For on-chip systems with high integration level, the precise and efficient control of the propagation of electromagnetic waves and heat fluxes simultaneously is particularly important. In this study, we propose a graphical designing method (i.e., thermal-electromagnetic surface transformation) based on thermal-electromagnetic null medium to simultaneously control the propagation of electromagnetic waves and thermal fields according to the pre-designed paths. A thermal-electromagnetic cloak, which can create a cloaking effect on both electromagnetic waves and thermal fields simultaneously, is designed by thermal-electromagnetic surface transformation and verified by both numerical simulations and experimental measurements. The thermal-electromagnetic surface transformation proposed in this study provides a new methodology for simultaneous controlling on electromagnetic and temperature fields, and may have significant applications in improving thermal-electromagnetic compatibility problem, protecting of thermal-electromagnetic sensitive components, and improving efficiency of energy usage for complex on-chip systems.
ISSN:2097-0382