The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary Nanoprecipitates
A theoretical model is suggested that describes the effect of deformation temperature on the yield stress of an ultrafine-grained (UFG) Al-Cu-Zr alloy structured with severe plastic deformation. Within the model, nanoprecipitates (NPs) of Al<sub>2</sub>Cu act as sources of lattice disloc...
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MDPI AG
2023-12-01
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author | Mikhail Yu. Gutkin Tatiana S. Orlova Nikolai V. Skiba |
author_facet | Mikhail Yu. Gutkin Tatiana S. Orlova Nikolai V. Skiba |
author_sort | Mikhail Yu. Gutkin |
collection | DOAJ |
description | A theoretical model is suggested that describes the effect of deformation temperature on the yield stress of an ultrafine-grained (UFG) Al-Cu-Zr alloy structured with severe plastic deformation. Within the model, nanoprecipitates (NPs) of Al<sub>2</sub>Cu act as sources of lattice dislocations in the presence of a number of extrinsic grain-boundary dislocations (EGBDs) near the NPs. It is shown that the number of EGBDs near the NPs decreases with a drop in the deformation temperature that increases the yield stress of the Al-Cu-Zr alloy. The proposed model is in good quantitative agreement with available experimental results. |
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issn | 2075-4701 |
language | English |
last_indexed | 2024-03-08T20:31:51Z |
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spelling | doaj.art-4dd1ba0ca2ea4faaae434c232853d8f02023-12-22T14:24:46ZengMDPI AGMetals2075-47012023-12-011312199310.3390/met13121993The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary NanoprecipitatesMikhail Yu. Gutkin0Tatiana S. Orlova1Nikolai V. Skiba2Institute for Problems in Mechanical Engineering, Russian Academy of Sciences, St. Petersburg 199178, RussiaIoffe Institute, St. Petersburg 194021, RussiaIoffe Institute, St. Petersburg 194021, RussiaA theoretical model is suggested that describes the effect of deformation temperature on the yield stress of an ultrafine-grained (UFG) Al-Cu-Zr alloy structured with severe plastic deformation. Within the model, nanoprecipitates (NPs) of Al<sub>2</sub>Cu act as sources of lattice dislocations in the presence of a number of extrinsic grain-boundary dislocations (EGBDs) near the NPs. It is shown that the number of EGBDs near the NPs decreases with a drop in the deformation temperature that increases the yield stress of the Al-Cu-Zr alloy. The proposed model is in good quantitative agreement with available experimental results.https://www.mdpi.com/2075-4701/13/12/1993ultrafine-grained aluminum alloysyield stresslow deformation temperaturegrain boundariesdislocationsnanoprecipitates |
spellingShingle | Mikhail Yu. Gutkin Tatiana S. Orlova Nikolai V. Skiba The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary Nanoprecipitates Metals ultrafine-grained aluminum alloys yield stress low deformation temperature grain boundaries dislocations nanoprecipitates |
title | The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary Nanoprecipitates |
title_full | The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary Nanoprecipitates |
title_fullStr | The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary Nanoprecipitates |
title_full_unstemmed | The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary Nanoprecipitates |
title_short | The Effect of Deformation Temperature on the Yield Stress of Ultrafine-Grained Al-Cu-Zr Alloy Containing Grain Boundary Nanoprecipitates |
title_sort | effect of deformation temperature on the yield stress of ultrafine grained al cu zr alloy containing grain boundary nanoprecipitates |
topic | ultrafine-grained aluminum alloys yield stress low deformation temperature grain boundaries dislocations nanoprecipitates |
url | https://www.mdpi.com/2075-4701/13/12/1993 |
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