Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

The curing behavior of a thermosetting material that influences the properties of the material is a key issue for predicting the changes in material properties during processing. An empirical equation can describe the reaction kinetics of the curing behavior of an investigated material, which is usu...

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Bibliographic Details
Main Authors:	Shuang Yan, Wolfgang Verestek, Harald Zeizinger, Siegfried Schmauder
Format:	Article
Language:	English
Published:	MDPI AG 2021-09-01
Series:	Polymers
Subjects:	epoxy curing reaction kinetics molecular dynamics dielectric analysis (DEA) differential scanning calorimetry (DSC)
Online Access:	https://www.mdpi.com/2073-4360/13/18/3085

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