A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications
Taper-cutting experiments are important means of exploring the nano-cutting mechanisms of hard and brittle materials. Under current cutting conditions, the brittle-ductile transition depth (BDTD) of a material can be obtained through a taper-cutting experiment. However, taper-cutting experiments mos...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2021-08-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/12/8/929 |
| _version_ | 1797522840958795776 |
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| author | Xudong Yang Zexiao Li Linlin Zhu Yuchu Dong Lei Liu Li Miao Xiaodong Zhang |
| author_facet | Xudong Yang Zexiao Li Linlin Zhu Yuchu Dong Lei Liu Li Miao Xiaodong Zhang |
| author_sort | Xudong Yang |
| collection | DOAJ |
| description | Taper-cutting experiments are important means of exploring the nano-cutting mechanisms of hard and brittle materials. Under current cutting conditions, the brittle-ductile transition depth (BDTD) of a material can be obtained through a taper-cutting experiment. However, taper-cutting experiments mostly rely on ultra-precision machining tools, which have a low efficiency and high cost, and it is thus difficult to realize in situ measurements. For taper-cut surfaces, three-dimensional microscopy and two-dimensional image calculation methods are generally used to obtain the BDTDs of materials, which have a great degree of subjectivity, leading to low accuracy. In this paper, an integrated system-processing platform is designed and established in order to realize the processing, measurement, and evaluation of taper-cutting experiments on hard and brittle materials. A spectral confocal sensor is introduced to assist in the assembly and adjustment of the workpiece. This system can directly perform taper-cutting experiments rather than using ultra-precision machining tools, and a small white light interference sensor is integrated for in situ measurement of the three-dimensional topography of the cutting surface. A method for the calculation of BDTD is proposed in order to accurately obtain the BDTDs of materials based on three-dimensional data that are supplemented by two-dimensional images. The results show that the cutting effects of the integrated platform on taper cutting have a strong agreement with the effects of ultra-precision machining tools, thus proving the stability and reliability of the integrated platform. The two-dimensional image measurement results show that the proposed measurement method is accurate and feasible. Finally, microstructure arrays were fabricated on the integrated platform as a typical case of a high-precision application. |
| first_indexed | 2024-03-10T08:35:04Z |
| format | Article |
| id | doaj.art-4e2eb63bc12641cb8ef3a85ea23452af |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T08:35:04Z |
| publishDate | 2021-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-4e2eb63bc12641cb8ef3a85ea23452af2023-11-22T08:44:12ZengMDPI AGMicromachines2072-666X2021-08-0112892910.3390/mi12080929A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and ApplicationsXudong Yang0Zexiao Li1Linlin Zhu2Yuchu Dong3Lei Liu4Li Miao5Xiaodong Zhang6State Key Laboratory of Precision Measuring Technology and Instruments, Laborotary of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, ChinaState Key Laboratory of Precision Measuring Technology and Instruments, Laborotary of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, ChinaState Key Laboratory of Precision Measuring Technology and Instruments, Laborotary of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, ChinaState Key Laboratory of Precision Measuring Technology and Instruments, Laborotary of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, ChinaState Key Laboratory of Precision Measuring Technology and Instruments, Laborotary of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, ChinaState Key Laboratory of Precision Measuring Technology and Instruments, Laborotary of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, ChinaState Key Laboratory of Precision Measuring Technology and Instruments, Laborotary of MicroNano Manufacturing Technology, Tianjin University, Tianjin 300072, ChinaTaper-cutting experiments are important means of exploring the nano-cutting mechanisms of hard and brittle materials. Under current cutting conditions, the brittle-ductile transition depth (BDTD) of a material can be obtained through a taper-cutting experiment. However, taper-cutting experiments mostly rely on ultra-precision machining tools, which have a low efficiency and high cost, and it is thus difficult to realize in situ measurements. For taper-cut surfaces, three-dimensional microscopy and two-dimensional image calculation methods are generally used to obtain the BDTDs of materials, which have a great degree of subjectivity, leading to low accuracy. In this paper, an integrated system-processing platform is designed and established in order to realize the processing, measurement, and evaluation of taper-cutting experiments on hard and brittle materials. A spectral confocal sensor is introduced to assist in the assembly and adjustment of the workpiece. This system can directly perform taper-cutting experiments rather than using ultra-precision machining tools, and a small white light interference sensor is integrated for in situ measurement of the three-dimensional topography of the cutting surface. A method for the calculation of BDTD is proposed in order to accurately obtain the BDTDs of materials based on three-dimensional data that are supplemented by two-dimensional images. The results show that the cutting effects of the integrated platform on taper cutting have a strong agreement with the effects of ultra-precision machining tools, thus proving the stability and reliability of the integrated platform. The two-dimensional image measurement results show that the proposed measurement method is accurate and feasible. Finally, microstructure arrays were fabricated on the integrated platform as a typical case of a high-precision application.https://www.mdpi.com/2072-666X/12/8/929integrated platformtaper cuttingbrittle-ductile transition depthmicrostructure |
| spellingShingle | Xudong Yang Zexiao Li Linlin Zhu Yuchu Dong Lei Liu Li Miao Xiaodong Zhang A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications Micromachines integrated platform taper cutting brittle-ductile transition depth microstructure |
| title | A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications |
| title_full | A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications |
| title_fullStr | A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications |
| title_full_unstemmed | A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications |
| title_short | A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications |
| title_sort | self established machining measurement evaluation integrated platform for taper cutting experiments and applications |
| topic | integrated platform taper cutting brittle-ductile transition depth microstructure |
| url | https://www.mdpi.com/2072-666X/12/8/929 |
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