Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors

Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors

This paper presents an ultra-small absolute pressure sensor with a silicon-micromachined TSV backside interconnection for high-performance, high spatial resolution contact pressure sensing, including flexible-substrate applications. By exploiting silicon-micromachined TSVs that are compatibly fabric...

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Bibliographic Details
Main Authors:	Weiwen Feng, Peng Li, Haozhi Zhang, Ke Sun, Wei Li, Jiachou Wang, Heng Yang, Xinxin Li
Format:	Article
Language:	English
Published:	MDPI AG 2023-07-01
Series:	Micromachines
Subjects:	pressure sensor silicon micromachined TSV backside interconnection MIS process
Online Access:	https://www.mdpi.com/2072-666X/14/7/1448

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