Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration
Silicon carbide bonded diamond composites are a class of materials with great potential for a wide range of demanding applications in industry. They can be produced by pressureless infiltration of diamond preforms with liquid silicon. In addition to their high hardness and very high wear resistance,...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
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Elsevier
2023-09-01
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Series: | Open Ceramics |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2666539523000585 |
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author | B. Matthey S. Kunze A. Kaiser M. Herrmann |
author_facet | B. Matthey S. Kunze A. Kaiser M. Herrmann |
author_sort | B. Matthey |
collection | DOAJ |
description | Silicon carbide bonded diamond composites are a class of materials with great potential for a wide range of demanding applications in industry. They can be produced by pressureless infiltration of diamond preforms with liquid silicon. In addition to their high hardness and very high wear resistance, the materials have a high thermal conductivity of up to 636 W/m⋅K, which is about 50 % higher than the value of silver. The analysis of materials with different diamond contents and grain sizes shows that the thermal conductivity increases with increasing grain size of the diamonds as well as with the volume content. Based on the experimental data, an interface conductance can be estimated for the SiC diamond interface. This value is similar to the values determined for diamond/Si interfaces. An increasing graphitization of the interface leads to a strong reduction of the thermal conductivity of the composites. |
first_indexed | 2024-03-12T13:10:11Z |
format | Article |
id | doaj.art-507fefb237f542e09a648473ee827189 |
institution | Directory Open Access Journal |
issn | 2666-5395 |
language | English |
last_indexed | 2024-03-12T13:10:11Z |
publishDate | 2023-09-01 |
publisher | Elsevier |
record_format | Article |
series | Open Ceramics |
spelling | doaj.art-507fefb237f542e09a648473ee8271892023-08-28T04:23:16ZengElsevierOpen Ceramics2666-53952023-09-0115100386Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltrationB. Matthey0S. Kunze1A. Kaiser2M. Herrmann3Corresponding author.; Fraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, 01277, Dresden, GermanyFraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, 01277, Dresden, GermanyFraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, 01277, Dresden, GermanyFraunhofer IKTS, Fraunhofer Institute for Ceramic Technologies and Systems, 01277, Dresden, GermanySilicon carbide bonded diamond composites are a class of materials with great potential for a wide range of demanding applications in industry. They can be produced by pressureless infiltration of diamond preforms with liquid silicon. In addition to their high hardness and very high wear resistance, the materials have a high thermal conductivity of up to 636 W/m⋅K, which is about 50 % higher than the value of silver. The analysis of materials with different diamond contents and grain sizes shows that the thermal conductivity increases with increasing grain size of the diamonds as well as with the volume content. Based on the experimental data, an interface conductance can be estimated for the SiC diamond interface. This value is similar to the values determined for diamond/Si interfaces. An increasing graphitization of the interface leads to a strong reduction of the thermal conductivity of the composites.http://www.sciencedirect.com/science/article/pii/S2666539523000585 |
spellingShingle | B. Matthey S. Kunze A. Kaiser M. Herrmann Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration Open Ceramics |
title | Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration |
title_full | Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration |
title_fullStr | Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration |
title_full_unstemmed | Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration |
title_short | Thermal properties of SiC-bonded diamond materials produced by liquid silicon infiltration |
title_sort | thermal properties of sic bonded diamond materials produced by liquid silicon infiltration |
url | http://www.sciencedirect.com/science/article/pii/S2666539523000585 |
work_keys_str_mv | AT bmatthey thermalpropertiesofsicbondeddiamondmaterialsproducedbyliquidsiliconinfiltration AT skunze thermalpropertiesofsicbondeddiamondmaterialsproducedbyliquidsiliconinfiltration AT akaiser thermalpropertiesofsicbondeddiamondmaterialsproducedbyliquidsiliconinfiltration AT mherrmann thermalpropertiesofsicbondeddiamondmaterialsproducedbyliquidsiliconinfiltration |