An approximate analytical solution for dynamic heat transfer of building walls

The present work deals with an approximate analytical solution for the dynamic temperature field due to the coupled effect of building walls to the adjacent environment. The solution is derived within the framework of weighted residuals and can be used as a handy tool to realize a reasonable estimat...

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Main Authors: C. Concilio, P. Di Luccia, G. Cuccurullo
Format: Article
Language:English
Published: Elsevier 2023-02-01
Series:Case Studies in Thermal Engineering
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X22009303
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author C. Concilio
P. Di Luccia
G. Cuccurullo
author_facet C. Concilio
P. Di Luccia
G. Cuccurullo
author_sort C. Concilio
collection DOAJ
description The present work deals with an approximate analytical solution for the dynamic temperature field due to the coupled effect of building walls to the adjacent environment. The solution is derived within the framework of weighted residuals and can be used as a handy tool to realize a reasonable estimation of the building thermal performance and to elucidate the dependence on the room descriptive parameters. Results from the present model are compared with predictions arising from both a commercial FEM code and the analytical solution from the standard EN 13786, showing satisfactory results. This conclusion is not surprising since it is demonstrable in view of the characteristic-time responses of the climatic forcing and the building walls. Finally, as an example of application of this approach, the model was focused on describing the thermal response of an open-loop regulated indoor environment.
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spelling doaj.art-5123396b18dc4595a95450bb8a57aba22023-02-02T04:48:29ZengElsevierCase Studies in Thermal Engineering2214-157X2023-02-0142102693An approximate analytical solution for dynamic heat transfer of building wallsC. Concilio0P. Di Luccia1G. Cuccurullo2Dipartimento di Ingegneria Industriale, Università degli Studi di Salerno, Via Giovanni Paolo II, 132, 84084, Fisciano (SA), ItalyDipartimento di Ingegneria Industriale, Università degli Studi di Salerno, Via Giovanni Paolo II, 132, 84084, Fisciano (SA), ItalyCorresponding author.; Dipartimento di Ingegneria Industriale, Università degli Studi di Salerno, Via Giovanni Paolo II, 132, 84084, Fisciano (SA), ItalyThe present work deals with an approximate analytical solution for the dynamic temperature field due to the coupled effect of building walls to the adjacent environment. The solution is derived within the framework of weighted residuals and can be used as a handy tool to realize a reasonable estimation of the building thermal performance and to elucidate the dependence on the room descriptive parameters. Results from the present model are compared with predictions arising from both a commercial FEM code and the analytical solution from the standard EN 13786, showing satisfactory results. This conclusion is not surprising since it is demonstrable in view of the characteristic-time responses of the climatic forcing and the building walls. Finally, as an example of application of this approach, the model was focused on describing the thermal response of an open-loop regulated indoor environment.http://www.sciencedirect.com/science/article/pii/S2214157X22009303
spellingShingle C. Concilio
P. Di Luccia
G. Cuccurullo
An approximate analytical solution for dynamic heat transfer of building walls
Case Studies in Thermal Engineering
title An approximate analytical solution for dynamic heat transfer of building walls
title_full An approximate analytical solution for dynamic heat transfer of building walls
title_fullStr An approximate analytical solution for dynamic heat transfer of building walls
title_full_unstemmed An approximate analytical solution for dynamic heat transfer of building walls
title_short An approximate analytical solution for dynamic heat transfer of building walls
title_sort approximate analytical solution for dynamic heat transfer of building walls
url http://www.sciencedirect.com/science/article/pii/S2214157X22009303
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