Research on Thermal Design for QSFP-DD Transceiver Module

In recent years, 200/400 Gbit/s transceiver in the form of Quad Small Form Factor Pluggable-Double Density (QSFP-DD) is favored by the market due to their relatively low power consumption and small size for high-density deployment. However, the deterioration of heat dissipation caused by high speed...

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Main Authors: Yu YE, Yan-chao MA
Format: Article
Language:zho
Published: 《光通信研究》编辑部 2022-08-01
Series:Guangtongxin yanjiu
Subjects:
Online Access:http://www.gtxyj.com.cn/thesisDetails#10.13756/j.gtxyj.2022.04.010&lang=zh
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author Yu YE
Yan-chao MA
author_facet Yu YE
Yan-chao MA
author_sort Yu YE
collection DOAJ
description In recent years, 200/400 Gbit/s transceiver in the form of Quad Small Form Factor Pluggable-Double Density (QSFP-DD) is favored by the market due to their relatively low power consumption and small size for high-density deployment. However, the deterioration of heat dissipation caused by high speed and small size limits the application of QSFP-DD optical modules. In this paper, the finite element method is used to conduct thermal modeling and simulation of QSFP-DD module, and the internal temperature field of 200 Gbit/s QSFP-DD Long Range 4(LR4) optical module in high temperature environment is studied. The effect of thermal pad on improving the internal heat dissipation of the module is verified. The performance of the module in high temperature environment is measured. It provides a reference for the design and application of QSFP-DD transceiver module.
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spelling doaj.art-516a7951704e498d889932afa6ff47562022-12-22T02:45:28Zzho《光通信研究》编辑部Guangtongxin yanjiu1005-87882022-08-014475110.13756/j.gtxyj.2022.04.0101005-8788(2022)04-0047-05Research on Thermal Design for QSFP-DD Transceiver ModuleYu YE0Yan-chao MA1Shenzhen Hi-Optel Technology Co., Ltd., Shenzhen 518000, ChinaShenzhen Hengpu Technology Co., Ltd., Shenzhen 518000, ChinaIn recent years, 200/400 Gbit/s transceiver in the form of Quad Small Form Factor Pluggable-Double Density (QSFP-DD) is favored by the market due to their relatively low power consumption and small size for high-density deployment. However, the deterioration of heat dissipation caused by high speed and small size limits the application of QSFP-DD optical modules. In this paper, the finite element method is used to conduct thermal modeling and simulation of QSFP-DD module, and the internal temperature field of 200 Gbit/s QSFP-DD Long Range 4(LR4) optical module in high temperature environment is studied. The effect of thermal pad on improving the internal heat dissipation of the module is verified. The performance of the module in high temperature environment is measured. It provides a reference for the design and application of QSFP-DD transceiver module.http://www.gtxyj.com.cn/thesisDetails#10.13756/j.gtxyj.2022.04.010&lang=zhqsfp-dd optical modulesthermal padthermal analysis
spellingShingle Yu YE
Yan-chao MA
Research on Thermal Design for QSFP-DD Transceiver Module
Guangtongxin yanjiu
qsfp-dd optical modules
thermal pad
thermal analysis
title Research on Thermal Design for QSFP-DD Transceiver Module
title_full Research on Thermal Design for QSFP-DD Transceiver Module
title_fullStr Research on Thermal Design for QSFP-DD Transceiver Module
title_full_unstemmed Research on Thermal Design for QSFP-DD Transceiver Module
title_short Research on Thermal Design for QSFP-DD Transceiver Module
title_sort research on thermal design for qsfp dd transceiver module
topic qsfp-dd optical modules
thermal pad
thermal analysis
url http://www.gtxyj.com.cn/thesisDetails#10.13756/j.gtxyj.2022.04.010&lang=zh
work_keys_str_mv AT yuye researchonthermaldesignforqsfpddtransceivermodule
AT yanchaoma researchonthermaldesignforqsfpddtransceivermodule