Electrical and Mechanical Analysis of Different TSV Geometries

Electrical and Mechanical Analysis of Different TSV Geometries

Through-silicon via (TSV) is an important component for implementing 3-D packages and 3-D integrated circuits as the TSV technology allows stacked silicon chips to interconnect through direct contact to help facilitate high-speed signal processing. By facilitating the stacking of silicon chips, the...

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Bibliographic Details
Main Authors: Il Ho Jeong, Alireza Eslami Majd, Jae Pil Jung, Nduka Nnamdi Ekere
Format: Article
Language:English
Published: MDPI AG 2020-04-01
Series:Metals
Subjects:
TSV
electrical analysis
mechanical analysis
simulation
Online Access:https://www.mdpi.com/2075-4701/10/4/467

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