The Development and Progress of Multi-Physics Simulation Design for TSV-Based 3D Integrated System
In order to meet the requirements of high performance, miniaturization, low cost, low power consumption and multi-function, three-dimensional (3D) integrated technology has gradually become a core technology. With the development of 3D integrated technology, it has been used in imaging sensors, opti...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-02-01
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| Series: | Symmetry |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-8994/15/2/418 |