Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages
Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of...
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| Format: | Article |
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MDPI AG
2023-07-01
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| Series: | Materials |
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| Online Access: | https://www.mdpi.com/1996-1944/16/13/4808 |
| _version_ | 1797591269524897792 |
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| author | Giuseppe Mirone Raffaele Barbagallo Giuseppe Bua Guido La Rosa |
| author_facet | Giuseppe Mirone Raffaele Barbagallo Giuseppe Bua Guido La Rosa |
| author_sort | Giuseppe Mirone |
| collection | DOAJ |
| description | Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of this phenomenon is very challenging for the identification of the appropriate modeling tools and their subsequent calibration. In this study, we present an advanced FE modeling approach for delamination, together with fundamental guidelines to calibrate it. Considering a reference power electronics package subjected to thermomechanical loads, FE simulations with a global–local approach are proposed, also including the implementation of a bi-linear cohesive zone model (CZM) to simulate the complex interfacial behavior between the different layers of the package. A parametric study and sensitivity analysis is presented, exploring the effects of individual CZM variables on the delamination behavior, identifying the most crucial ones and accurately describing their underlying functioning. Then, this work gives valuable insights and guidelines related to advanced and aware FE simulations of delamination in power electronics packages, useful for the design and optimization of these devices to mitigate their vulnerability to thermomechanical loads. |
| first_indexed | 2024-03-11T01:35:06Z |
| format | Article |
| id | doaj.art-52b546d1b77a48e8b51f4c2a5b0a69fb |
| institution | Directory Open Access Journal |
| issn | 1996-1944 |
| language | English |
| last_indexed | 2024-03-11T01:35:06Z |
| publishDate | 2023-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Materials |
| spelling | doaj.art-52b546d1b77a48e8b51f4c2a5b0a69fb2023-11-18T17:00:08ZengMDPI AGMaterials1996-19442023-07-011613480810.3390/ma16134808Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics PackagesGiuseppe Mirone0Raffaele Barbagallo1Giuseppe Bua2Guido La Rosa3Department of Civil Engineering and Architecture, University of Catania, Viale A. Doria 6, 95125 Catania, ItalyDepartment of Civil Engineering and Architecture, University of Catania, Viale A. Doria 6, 95125 Catania, ItalyDepartment of Civil Engineering and Architecture, University of Catania, Viale A. Doria 6, 95125 Catania, ItalyDepartment of Civil Engineering and Architecture, University of Catania, Viale A. Doria 6, 95125 Catania, ItalyDelamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of this phenomenon is very challenging for the identification of the appropriate modeling tools and their subsequent calibration. In this study, we present an advanced FE modeling approach for delamination, together with fundamental guidelines to calibrate it. Considering a reference power electronics package subjected to thermomechanical loads, FE simulations with a global–local approach are proposed, also including the implementation of a bi-linear cohesive zone model (CZM) to simulate the complex interfacial behavior between the different layers of the package. A parametric study and sensitivity analysis is presented, exploring the effects of individual CZM variables on the delamination behavior, identifying the most crucial ones and accurately describing their underlying functioning. Then, this work gives valuable insights and guidelines related to advanced and aware FE simulations of delamination in power electronics packages, useful for the design and optimization of these devices to mitigate their vulnerability to thermomechanical loads.https://www.mdpi.com/1996-1944/16/13/4808delaminationpower electronics packagesFEM simulationcohesive zone modelinterfacial behaviorreliability |
| spellingShingle | Giuseppe Mirone Raffaele Barbagallo Giuseppe Bua Guido La Rosa Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages Materials delamination power electronics packages FEM simulation cohesive zone model interfacial behavior reliability |
| title | Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages |
| title_full | Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages |
| title_fullStr | Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages |
| title_full_unstemmed | Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages |
| title_short | Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages |
| title_sort | finite element simulation and sensitivity analysis of the cohesive parameters for delamination modeling in power electronics packages |
| topic | delamination power electronics packages FEM simulation cohesive zone model interfacial behavior reliability |
| url | https://www.mdpi.com/1996-1944/16/13/4808 |
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