Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of...

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Bibliographic Details
Main Authors: Giuseppe Mirone, Raffaele Barbagallo, Giuseppe Bua, Guido La Rosa
Format: Article
Language:English
Published: MDPI AG 2023-07-01
Series:Materials
Subjects:
delamination
power electronics packages
FEM simulation
cohesive zone model
interfacial behavior
reliability
Online Access:https://www.mdpi.com/1996-1944/16/13/4808

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