Flexible Electronics Sensors for Tactile Multi-Touching
Flexible electronics sensors for tactile applications in multi-touch sensing and large scale manufacturing were designed and fabricated. The sensors are based on polyimide substrates, with thixotropy materials used to print organic resistances and a bump on the top polyimide layer. The gap between t...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2009-02-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | http://www.mdpi.com/1424-8220/9/2/1188/ |
| _version_ | 1828395768950554624 |
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| author | Shao-Hsing Yeh Yu-Cheng Lin Te-Hua Fang Wen-Yang Chang |
| author_facet | Shao-Hsing Yeh Yu-Cheng Lin Te-Hua Fang Wen-Yang Chang |
| author_sort | Shao-Hsing Yeh |
| collection | DOAJ |
| description | Flexible electronics sensors for tactile applications in multi-touch sensing and large scale manufacturing were designed and fabricated. The sensors are based on polyimide substrates, with thixotropy materials used to print organic resistances and a bump on the top polyimide layer. The gap between the bottom electrode layer and the resistance layer provides a buffer distance to reduce erroneous contact during large bending. Experimental results show that the top membrane with a bump protrusion and a resistance layer had a large deflection and a quick sensitive response. The bump and resistance layer provided a concentrated von Mises stress force and inertial force on the top membrane center. When the top membrane had no bump, it had a transient response delay time and took longer to reach steady-state. For printing thick structures of flexible electronics sensors, diffusion effects and dimensional shrinkages can be improved by using a paste material with a high viscosity. Linear algorithm matrixes with Gaussian elimination and control system scanning were used for multi-touch detection. Flexible electronics sensors were printed with a resistance thickness of about 32 µm and a bump thickness of about 0.2 mm. Feasibility studies show that printing technology is appropriate for large scale manufacturing, producing sensors at a low cost. |
| first_indexed | 2024-12-10T08:18:51Z |
| format | Article |
| id | doaj.art-53762b8458f946fd9aa8af9626386fe3 |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2024-12-10T08:18:51Z |
| publishDate | 2009-02-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-53762b8458f946fd9aa8af9626386fe32022-12-22T01:56:24ZengMDPI AGSensors1424-82202009-02-01921188120310.3390/s9021188Flexible Electronics Sensors for Tactile Multi-TouchingShao-Hsing YehYu-Cheng LinTe-Hua FangWen-Yang ChangFlexible electronics sensors for tactile applications in multi-touch sensing and large scale manufacturing were designed and fabricated. The sensors are based on polyimide substrates, with thixotropy materials used to print organic resistances and a bump on the top polyimide layer. The gap between the bottom electrode layer and the resistance layer provides a buffer distance to reduce erroneous contact during large bending. Experimental results show that the top membrane with a bump protrusion and a resistance layer had a large deflection and a quick sensitive response. The bump and resistance layer provided a concentrated von Mises stress force and inertial force on the top membrane center. When the top membrane had no bump, it had a transient response delay time and took longer to reach steady-state. For printing thick structures of flexible electronics sensors, diffusion effects and dimensional shrinkages can be improved by using a paste material with a high viscosity. Linear algorithm matrixes with Gaussian elimination and control system scanning were used for multi-touch detection. Flexible electronics sensors were printed with a resistance thickness of about 32 µm and a bump thickness of about 0.2 mm. Feasibility studies show that printing technology is appropriate for large scale manufacturing, producing sensors at a low cost.http://www.mdpi.com/1424-8220/9/2/1188/Flexible electronicstactilebendingorganic resistancemulti-touchingprinting technologylarge area |
| spellingShingle | Shao-Hsing Yeh Yu-Cheng Lin Te-Hua Fang Wen-Yang Chang Flexible Electronics Sensors for Tactile Multi-Touching Sensors Flexible electronics tactile bending organic resistance multi-touching printing technology large area |
| title | Flexible Electronics Sensors for Tactile Multi-Touching |
| title_full | Flexible Electronics Sensors for Tactile Multi-Touching |
| title_fullStr | Flexible Electronics Sensors for Tactile Multi-Touching |
| title_full_unstemmed | Flexible Electronics Sensors for Tactile Multi-Touching |
| title_short | Flexible Electronics Sensors for Tactile Multi-Touching |
| title_sort | flexible electronics sensors for tactile multi touching |
| topic | Flexible electronics tactile bending organic resistance multi-touching printing technology large area |
| url | http://www.mdpi.com/1424-8220/9/2/1188/ |
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