The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters

The factors that influence the formation of helium blisters in copper were studied, including crystallographic grain orientation and thermomechanical conditions. Helium implantation experiments were conducted at 40 KeV with a dose of 5 × 10<sup>17</sup> ions/cm<sup>2</sup>, a...

Full description

Bibliographic Details
Main Authors: Daniel Shtuckmeyster, Nitzan Maman, Moshe Vaknin, Gabriel Zamir, Victor Y. Zenou, Ulrich Kentsch, Itzchak Dahan, Roni Z. Shneck
Format: Article
Language:English
Published: MDPI AG 2024-02-01
Series:Metals
Subjects:
Online Access:https://www.mdpi.com/2075-4701/14/3/260
_version_ 1797240063391694848
author Daniel Shtuckmeyster
Nitzan Maman
Moshe Vaknin
Gabriel Zamir
Victor Y. Zenou
Ulrich Kentsch
Itzchak Dahan
Roni Z. Shneck
author_facet Daniel Shtuckmeyster
Nitzan Maman
Moshe Vaknin
Gabriel Zamir
Victor Y. Zenou
Ulrich Kentsch
Itzchak Dahan
Roni Z. Shneck
author_sort Daniel Shtuckmeyster
collection DOAJ
description The factors that influence the formation of helium blisters in copper were studied, including crystallographic grain orientation and thermomechanical conditions. Helium implantation experiments were conducted at 40 KeV with a dose of 5 × 10<sup>17</sup> ions/cm<sup>2</sup>, and the samples were then subjected to post-implantation heat treatments at 450 °C for different holding times. A scanning electron microscope (SEM) equipped with an electron backscatter diffraction (EBSD) detector was used to analyze the samples, revealing that the degree of blistering erosion and its evolution with time varied with the crystallographic plane of the free surface in different ways in annealed and cold rolled copper. Out of the investigated states, rolled copper with a (111) free surface had superior helium blistering durability. This is explained by the consideration of the multivariable situation, including the role of dislocations and vacancies. For future plasma-facing component (PFC) candidate material, similar research should be conducted in order to find the optimal combination of material properties for helium blistering durability. In the case of Cu selection as a PFC, the two practical approaches to obtain the preferred (111) orientation are cold rolling and thin layer technologies.
first_indexed 2024-04-24T18:01:28Z
format Article
id doaj.art-5395760ad1764621ac7e94b79f27e4d1
institution Directory Open Access Journal
issn 2075-4701
language English
last_indexed 2024-04-24T18:01:28Z
publishDate 2024-02-01
publisher MDPI AG
record_format Article
series Metals
spelling doaj.art-5395760ad1764621ac7e94b79f27e4d12024-03-27T13:54:15ZengMDPI AGMetals2075-47012024-02-0114326010.3390/met14030260The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium BlistersDaniel Shtuckmeyster0Nitzan Maman1Moshe Vaknin2Gabriel Zamir3Victor Y. Zenou4Ulrich Kentsch5Itzchak Dahan6Roni Z. Shneck7Department of Materials Engineering, Ben Gurion University of the Negev, Beer-Sheva 84105, IsraelIlse Katz Institute for Nanoscale Science & Technology, Beer-Sheva 84105, IsraelMaterials Department, Nuclear Research Center of the Negev (NRCN), Beer-Sheva P.O. Box 9001, IsraelMaterials Department, Nuclear Research Center of the Negev (NRCN), Beer-Sheva P.O. Box 9001, IsraelDepartment of Materials Engineering, Ben Gurion University of the Negev, Beer-Sheva 84105, IsraelHead Implanter, Helmholtz-Zentrum Dresden-Rossendorf, 01328 Dresden, GermanyMaterials Department, Nuclear Research Center of the Negev (NRCN), Beer-Sheva P.O. Box 9001, IsraelDepartment of Materials Engineering, Ben Gurion University of the Negev, Beer-Sheva 84105, IsraelThe factors that influence the formation of helium blisters in copper were studied, including crystallographic grain orientation and thermomechanical conditions. Helium implantation experiments were conducted at 40 KeV with a dose of 5 × 10<sup>17</sup> ions/cm<sup>2</sup>, and the samples were then subjected to post-implantation heat treatments at 450 °C for different holding times. A scanning electron microscope (SEM) equipped with an electron backscatter diffraction (EBSD) detector was used to analyze the samples, revealing that the degree of blistering erosion and its evolution with time varied with the crystallographic plane of the free surface in different ways in annealed and cold rolled copper. Out of the investigated states, rolled copper with a (111) free surface had superior helium blistering durability. This is explained by the consideration of the multivariable situation, including the role of dislocations and vacancies. For future plasma-facing component (PFC) candidate material, similar research should be conducted in order to find the optimal combination of material properties for helium blistering durability. In the case of Cu selection as a PFC, the two practical approaches to obtain the preferred (111) orientation are cold rolling and thin layer technologies.https://www.mdpi.com/2075-4701/14/3/260plasma-facing componentshelium blisteringthermo-mechanical statecrystal orientationdislocations and vacancies
spellingShingle Daniel Shtuckmeyster
Nitzan Maman
Moshe Vaknin
Gabriel Zamir
Victor Y. Zenou
Ulrich Kentsch
Itzchak Dahan
Roni Z. Shneck
The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters
Metals
plasma-facing components
helium blistering
thermo-mechanical state
crystal orientation
dislocations and vacancies
title The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters
title_full The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters
title_fullStr The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters
title_full_unstemmed The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters
title_short The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters
title_sort influence of crystal orientation and thermal state of a pure cu on the formation of helium blisters
topic plasma-facing components
helium blistering
thermo-mechanical state
crystal orientation
dislocations and vacancies
url https://www.mdpi.com/2075-4701/14/3/260
work_keys_str_mv AT danielshtuckmeyster theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT nitzanmaman theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT moshevaknin theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT gabrielzamir theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT victoryzenou theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT ulrichkentsch theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT itzchakdahan theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT ronizshneck theinfluenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT danielshtuckmeyster influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT nitzanmaman influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT moshevaknin influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT gabrielzamir influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT victoryzenou influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT ulrichkentsch influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT itzchakdahan influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters
AT ronizshneck influenceofcrystalorientationandthermalstateofapurecuontheformationofheliumblisters