The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters
The factors that influence the formation of helium blisters in copper were studied, including crystallographic grain orientation and thermomechanical conditions. Helium implantation experiments were conducted at 40 KeV with a dose of 5 × 10<sup>17</sup> ions/cm<sup>2</sup>, a...
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2024-02-01
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author | Daniel Shtuckmeyster Nitzan Maman Moshe Vaknin Gabriel Zamir Victor Y. Zenou Ulrich Kentsch Itzchak Dahan Roni Z. Shneck |
author_facet | Daniel Shtuckmeyster Nitzan Maman Moshe Vaknin Gabriel Zamir Victor Y. Zenou Ulrich Kentsch Itzchak Dahan Roni Z. Shneck |
author_sort | Daniel Shtuckmeyster |
collection | DOAJ |
description | The factors that influence the formation of helium blisters in copper were studied, including crystallographic grain orientation and thermomechanical conditions. Helium implantation experiments were conducted at 40 KeV with a dose of 5 × 10<sup>17</sup> ions/cm<sup>2</sup>, and the samples were then subjected to post-implantation heat treatments at 450 °C for different holding times. A scanning electron microscope (SEM) equipped with an electron backscatter diffraction (EBSD) detector was used to analyze the samples, revealing that the degree of blistering erosion and its evolution with time varied with the crystallographic plane of the free surface in different ways in annealed and cold rolled copper. Out of the investigated states, rolled copper with a (111) free surface had superior helium blistering durability. This is explained by the consideration of the multivariable situation, including the role of dislocations and vacancies. For future plasma-facing component (PFC) candidate material, similar research should be conducted in order to find the optimal combination of material properties for helium blistering durability. In the case of Cu selection as a PFC, the two practical approaches to obtain the preferred (111) orientation are cold rolling and thin layer technologies. |
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language | English |
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spelling | doaj.art-5395760ad1764621ac7e94b79f27e4d12024-03-27T13:54:15ZengMDPI AGMetals2075-47012024-02-0114326010.3390/met14030260The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium BlistersDaniel Shtuckmeyster0Nitzan Maman1Moshe Vaknin2Gabriel Zamir3Victor Y. Zenou4Ulrich Kentsch5Itzchak Dahan6Roni Z. Shneck7Department of Materials Engineering, Ben Gurion University of the Negev, Beer-Sheva 84105, IsraelIlse Katz Institute for Nanoscale Science & Technology, Beer-Sheva 84105, IsraelMaterials Department, Nuclear Research Center of the Negev (NRCN), Beer-Sheva P.O. Box 9001, IsraelMaterials Department, Nuclear Research Center of the Negev (NRCN), Beer-Sheva P.O. Box 9001, IsraelDepartment of Materials Engineering, Ben Gurion University of the Negev, Beer-Sheva 84105, IsraelHead Implanter, Helmholtz-Zentrum Dresden-Rossendorf, 01328 Dresden, GermanyMaterials Department, Nuclear Research Center of the Negev (NRCN), Beer-Sheva P.O. Box 9001, IsraelDepartment of Materials Engineering, Ben Gurion University of the Negev, Beer-Sheva 84105, IsraelThe factors that influence the formation of helium blisters in copper were studied, including crystallographic grain orientation and thermomechanical conditions. Helium implantation experiments were conducted at 40 KeV with a dose of 5 × 10<sup>17</sup> ions/cm<sup>2</sup>, and the samples were then subjected to post-implantation heat treatments at 450 °C for different holding times. A scanning electron microscope (SEM) equipped with an electron backscatter diffraction (EBSD) detector was used to analyze the samples, revealing that the degree of blistering erosion and its evolution with time varied with the crystallographic plane of the free surface in different ways in annealed and cold rolled copper. Out of the investigated states, rolled copper with a (111) free surface had superior helium blistering durability. This is explained by the consideration of the multivariable situation, including the role of dislocations and vacancies. For future plasma-facing component (PFC) candidate material, similar research should be conducted in order to find the optimal combination of material properties for helium blistering durability. In the case of Cu selection as a PFC, the two practical approaches to obtain the preferred (111) orientation are cold rolling and thin layer technologies.https://www.mdpi.com/2075-4701/14/3/260plasma-facing componentshelium blisteringthermo-mechanical statecrystal orientationdislocations and vacancies |
spellingShingle | Daniel Shtuckmeyster Nitzan Maman Moshe Vaknin Gabriel Zamir Victor Y. Zenou Ulrich Kentsch Itzchak Dahan Roni Z. Shneck The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters Metals plasma-facing components helium blistering thermo-mechanical state crystal orientation dislocations and vacancies |
title | The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters |
title_full | The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters |
title_fullStr | The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters |
title_full_unstemmed | The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters |
title_short | The Influence of Crystal Orientation and Thermal State of a Pure Cu on the Formation of Helium Blisters |
title_sort | influence of crystal orientation and thermal state of a pure cu on the formation of helium blisters |
topic | plasma-facing components helium blistering thermo-mechanical state crystal orientation dislocations and vacancies |
url | https://www.mdpi.com/2075-4701/14/3/260 |
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