Tin Whisker Growth Suppression Using NiO Sublayers Fabricated by Dip Coating
Whiskers are small crystalline growths, which can grow from certain metals or alloys. Reaching up to several millimeters long, whiskers have the potential to cause device failures due to short circuits and contamination by debris. Tin (Sn) is one such metal that is particularly prone to whisker deve...
Main Authors: | Jacob D. Buchanan, Vamsi Borra, Md Maidul Islam, Daniel G. Georgiev, Srikanth Itapu |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2022-01-01
|
Series: | Condensed Matter |
Subjects: | |
Online Access: | https://www.mdpi.com/2410-3896/7/1/7 |
Similar Items
-
Whisker growth in tin surface finishes by immersion tin plating and hot dipping /
by: Lim, Hooi Peng, 1983-, author, et al.
Published: (2014) -
Whisker technology/
by: Levitt, Albert P.
Published: (1970) -
Effect of environmental condition and nickel underlayer on whiskers formation in tin surface finish /
by: Siti Zahira Yusof, 1989- author, et al.
Published: (2014) -
Effect of environmental condition and nickel underlayer on whiskers formation in tin surface finish [electronic resource] /
by: Siti Zahira Yusof, 1989- author, et al.
Published: (2014) -
Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
by: Aimi Noorliyana Hashim, et al.
Published: (2021-02-01)