Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic
This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled HCTSVs using Cu-MWCNT as a conductive filler and polymer liners such as polyimide, polypropylene carbonate (PPC), a...
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| Format: | Article |
| Language: | English |
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Elsevier
2023-09-01
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| Series: | e-Prime: Advances in Electrical Engineering, Electronics and Energy |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2772671123001420 |
| _version_ | 1797674897572364288 |
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| author | Katepogu Rajkumar G． Umamaheswara Reddy |
| author_facet | Katepogu Rajkumar G． Umamaheswara Reddy |
| author_sort | Katepogu Rajkumar |
| collection | DOAJ |
| description | This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled HCTSVs using Cu-MWCNT as a conductive filler and polymer liners such as polyimide, polypropylene carbonate (PPC), and benzocyclobutene (BCB) as insulating materials. The electrical equivalent circuit model is utilized to investigate the crosstalk induced by the ternary inverter in coupled HCTSVs. The effects of crosstalk such as functional and dynamic crosstalk for proposed HCTSVs are compared with Multi-walled CNT (MWCNT) TSVs using Hewlett simulation program with integrated circuit emphasis (HSPICE) simulations. Other performance parameters are also investigated, including power dissipation, power delay product (PDP), and energy delay product (EDP). The proposed model's crosstalk effects are also investigated for various TSV heights. The BCB-based coupled Cu-MWCNT HCTSVs provide a significant improvement in crosstalk at reduced TSV height. The proposed HCTSVs also improved overall performance by 32.12% when compared to the MWCNT based TSVs. As a result, Cu-MWCNT based HCTSVs with BCB liner are better than conventional TSVs for ternary logic integrated circuits (ICs). |
| first_indexed | 2024-03-11T22:05:49Z |
| format | Article |
| id | doaj.art-559e3100aa3f4e849c8d0c05191d85d0 |
| institution | Directory Open Access Journal |
| issn | 2772-6711 |
| language | English |
| last_indexed | 2024-03-11T22:05:49Z |
| publishDate | 2023-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | e-Prime: Advances in Electrical Engineering, Electronics and Energy |
| spelling | doaj.art-559e3100aa3f4e849c8d0c05191d85d02023-09-25T04:12:54ZengElseviere-Prime: Advances in Electrical Engineering, Electronics and Energy2772-67112023-09-015100247Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logicKatepogu Rajkumar0G． Umamaheswara Reddy1Corresponding author.; Department of Electronics and Communication Engineering, Sri Venkateswara University College of Engineering, Sri Venkateswara University, Tirupati, IndiaDepartment of Electronics and Communication Engineering, Sri Venkateswara University College of Engineering, Sri Venkateswara University, Tirupati, IndiaThis paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled HCTSVs using Cu-MWCNT as a conductive filler and polymer liners such as polyimide, polypropylene carbonate (PPC), and benzocyclobutene (BCB) as insulating materials. The electrical equivalent circuit model is utilized to investigate the crosstalk induced by the ternary inverter in coupled HCTSVs. The effects of crosstalk such as functional and dynamic crosstalk for proposed HCTSVs are compared with Multi-walled CNT (MWCNT) TSVs using Hewlett simulation program with integrated circuit emphasis (HSPICE) simulations. Other performance parameters are also investigated, including power dissipation, power delay product (PDP), and energy delay product (EDP). The proposed model's crosstalk effects are also investigated for various TSV heights. The BCB-based coupled Cu-MWCNT HCTSVs provide a significant improvement in crosstalk at reduced TSV height. The proposed HCTSVs also improved overall performance by 32.12% when compared to the MWCNT based TSVs. As a result, Cu-MWCNT based HCTSVs with BCB liner are better than conventional TSVs for ternary logic integrated circuits (ICs).http://www.sciencedirect.com/science/article/pii/S2772671123001420HCTSVsCNTs—SWCNTMWCNTsCu-MWCNT electrical equivalent circuit models TSV |
| spellingShingle | Katepogu Rajkumar G． Umamaheswara Reddy Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic e-Prime: Advances in Electrical Engineering, Electronics and Energy HCTSVs CNTs—SWCNT MWCNTs Cu-MWCNT electrical equivalent circuit models TSV |
| title | Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic |
| title_full | Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic |
| title_fullStr | Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic |
| title_full_unstemmed | Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic |
| title_short | Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic |
| title_sort | performance analysis of cu mwcnt bundled hctsvs using ternary logic |
| topic | HCTSVs CNTs—SWCNT MWCNTs Cu-MWCNT electrical equivalent circuit models TSV |
| url | http://www.sciencedirect.com/science/article/pii/S2772671123001420 |
| work_keys_str_mv | AT katepogurajkumar performanceanalysisofcumwcntbundledhctsvsusingternarylogic AT gumamaheswarareddy performanceanalysisofcumwcntbundledhctsvsusingternarylogic |