Numerical Investigation of Fluid Flow and Heat Transfer in High-Temperature Wavy Microchannels with Different Shaped Fins Cooled by Liquid Metal
The microchannel heat sink has been recognized as an excellent solution in high-density heat flux devices for its high efficiency in heat removal with limited spaces; however, the most effective structure of microchannels for heat dissipation is still unknown. In this study, the fluid flow and heat...
Main Authors: | Tingfang Yu, Xing Guo, Yicun Tang, Xuan Zhang, Lizhi Wang, Tao Wu |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2023-07-01
|
Series: | Micromachines |
Subjects: | |
Online Access: | https://www.mdpi.com/2072-666X/14/7/1366 |
Similar Items
-
Fluid flow and heat transfer behavior of a liquid based MEMS heat sink having wavy microchannels integrating circular pin-fins
by: Anas Alkhazaleh, et al.
Published: (2023-11-01) -
Liquid cooling of microelectronic chips using MEMS heat sink: Thermohydraulic characteristics of wavy microchannels with pin-fins
by: Anas Alkhazaleh, et al.
Published: (2023-05-01) -
A critical review of the straight and wavy microchannel heat sink and the application in lithium-ion battery thermal management
by: M. Hajialibabaei, et al.
Published: (2022-05-01) -
Thermo-Hydraulic Performance of Pin-Fins in Wavy and Straight Configurations
by: Mohamad Ziad Saghir, et al.
Published: (2022-06-01) -
Numerical simulation of the thermal performance of a wavy fin configuration for a straight fin array
by: J.O. Okon, et al.
Published: (2022-07-01)