Novel MEMS Multisensor Chip for Aerodynamic Pressure Measurements
The key equipment for performing aerodynamic testing of objects, such as road and railway vehicles, aircraft, and wind turbines, as well as stationary objects such as bridges and buildings, are multichannel pressure measurement instruments (pressure scanners). These instruments are typically based o...
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| Format: | Article |
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MDPI AG
2025-01-01
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| Series: | Sensors |
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| Online Access: | https://www.mdpi.com/1424-8220/25/3/600 |
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| author | Žarko Lazić Milče M. Smiljanić Dragan Tanasković Milena Rašljić-Rafajilović Katarina Cvetanović Evgenija Milinković Marko V. Bošković Stevan Andrić Ivana Jokić Predrag Poljak Miloš Frantlović |
| author_facet | Žarko Lazić Milče M. Smiljanić Dragan Tanasković Milena Rašljić-Rafajilović Katarina Cvetanović Evgenija Milinković Marko V. Bošković Stevan Andrić Ivana Jokić Predrag Poljak Miloš Frantlović |
| author_sort | Žarko Lazić |
| collection | DOAJ |
| description | The key equipment for performing aerodynamic testing of objects, such as road and railway vehicles, aircraft, and wind turbines, as well as stationary objects such as bridges and buildings, are multichannel pressure measurement instruments (pressure scanners). These instruments are typically based on arrays of separate pressure sensors built in an enclosure that also contains temperature sensors used for temperature compensation. However, there are significant limitations to such a construction, especially when increasing requirements in terms of miniaturization, the number of pressure channels, and high measurement performance must be met at the same time. In this paper, we present the development and realization of an innovative MEMS multisensor chip, which is designed with the intention of overcoming these limitations. The chip has four MEMS piezoresistive pressure-sensing elements and two resistive temperature-sensing elements, which are all monolithically integrated, enabling better sensor matching and thermal coupling while providing a high number of pressure channels per unit area. The main steps of chip development are preliminary chip design, numerical simulations of the chip’s mechanical behavior when exposed to the measured pressure, final chip design, fabrication processes (photolithography, thermal oxidation, diffusion, layer deposition, micromachining, anodic bonding, and wafer dicing), and electrical testing. |
| first_indexed | 2025-03-17T02:16:53Z |
| format | Article |
| id | doaj.art-5671feb062004a99bc47e42650477e7b |
| institution | Directory Open Access Journal |
| issn | 1424-8220 |
| language | English |
| last_indexed | 2025-03-17T02:16:53Z |
| publishDate | 2025-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Sensors |
| spelling | doaj.art-5671feb062004a99bc47e42650477e7b2025-02-12T15:12:18ZengMDPI AGSensors1424-82202025-01-0125360010.3390/s25030600Novel MEMS Multisensor Chip for Aerodynamic Pressure MeasurementsŽarko Lazić0Milče M. Smiljanić1Dragan Tanasković2Milena Rašljić-Rafajilović3Katarina Cvetanović4Evgenija Milinković5Marko V. Bošković6Stevan Andrić7Ivana Jokić8Predrag Poljak9Miloš Frantlović10Institute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaInstitute of Chemistry, Technology and Metallurgy (ICTM), National Institute of the Republic of Serbia, University of Belgrade, Njegoševa 12, 11000 Belgrade, SerbiaThe key equipment for performing aerodynamic testing of objects, such as road and railway vehicles, aircraft, and wind turbines, as well as stationary objects such as bridges and buildings, are multichannel pressure measurement instruments (pressure scanners). These instruments are typically based on arrays of separate pressure sensors built in an enclosure that also contains temperature sensors used for temperature compensation. However, there are significant limitations to such a construction, especially when increasing requirements in terms of miniaturization, the number of pressure channels, and high measurement performance must be met at the same time. In this paper, we present the development and realization of an innovative MEMS multisensor chip, which is designed with the intention of overcoming these limitations. The chip has four MEMS piezoresistive pressure-sensing elements and two resistive temperature-sensing elements, which are all monolithically integrated, enabling better sensor matching and thermal coupling while providing a high number of pressure channels per unit area. The main steps of chip development are preliminary chip design, numerical simulations of the chip’s mechanical behavior when exposed to the measured pressure, final chip design, fabrication processes (photolithography, thermal oxidation, diffusion, layer deposition, micromachining, anodic bonding, and wafer dicing), and electrical testing.https://www.mdpi.com/1424-8220/25/3/600MEMS multisensorpressure sensingchip fabrication |
| spellingShingle | Žarko Lazić Milče M. Smiljanić Dragan Tanasković Milena Rašljić-Rafajilović Katarina Cvetanović Evgenija Milinković Marko V. Bošković Stevan Andrić Ivana Jokić Predrag Poljak Miloš Frantlović Novel MEMS Multisensor Chip for Aerodynamic Pressure Measurements Sensors MEMS multisensor pressure sensing chip fabrication |
| title | Novel MEMS Multisensor Chip for Aerodynamic Pressure Measurements |
| title_full | Novel MEMS Multisensor Chip for Aerodynamic Pressure Measurements |
| title_fullStr | Novel MEMS Multisensor Chip for Aerodynamic Pressure Measurements |
| title_full_unstemmed | Novel MEMS Multisensor Chip for Aerodynamic Pressure Measurements |
| title_short | Novel MEMS Multisensor Chip for Aerodynamic Pressure Measurements |
| title_sort | novel mems multisensor chip for aerodynamic pressure measurements |
| topic | MEMS multisensor pressure sensing chip fabrication |
| url | https://www.mdpi.com/1424-8220/25/3/600 |
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