Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature
Copper nanoparticles have been deposited on silicon surfaces by a simple galvanic displacement reaction, and rapid thermal annealing has been performed under various atmospheric conditions. In spite of the general tendency of the agglomeration of nanoparticles to lower the surface energy at elevated...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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Beilstein-Institut
2017-02-01
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| Series: | Beilstein Journal of Nanotechnology |
| Subjects: | |
| Online Access: | https://doi.org/10.3762/bjnano.8.45 |
| _version_ | 1818361064670101504 |
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| author | Tapas Ghosh Biswarup Satpati |
| author_facet | Tapas Ghosh Biswarup Satpati |
| author_sort | Tapas Ghosh |
| collection | DOAJ |
| description | Copper nanoparticles have been deposited on silicon surfaces by a simple galvanic displacement reaction, and rapid thermal annealing has been performed under various atmospheric conditions. In spite of the general tendency of the agglomeration of nanoparticles to lower the surface energy at elevated temperatures, our plan-view and cross-sectional transmission electron microscopy (TEM), energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) analysis shows that the thermal oxidation of the copper nanoparticles and formation of cupric oxide (CuO) on silicon surfaces leads to wetting rather than agglomeration. In contrast, agglomeration has been observed when copper nanoparticles were annealed in a nitrogen environment. The lattice transformation from cubic Cu to monoclinic CuO, and hence the change in surface energy of the particles, assists the wetting process. The occurrence of wetting during the oxidation step implies a strong interaction between the oxidized film and the silicon surface. |
| first_indexed | 2024-12-13T21:10:45Z |
| format | Article |
| id | doaj.art-5678e4466b68404b8794544f1896e12a |
| institution | Directory Open Access Journal |
| issn | 2190-4286 |
| language | English |
| last_indexed | 2024-12-13T21:10:45Z |
| publishDate | 2017-02-01 |
| publisher | Beilstein-Institut |
| record_format | Article |
| series | Beilstein Journal of Nanotechnology |
| spelling | doaj.art-5678e4466b68404b8794544f1896e12a2022-12-21T23:31:21ZengBeilstein-InstitutBeilstein Journal of Nanotechnology2190-42862017-02-018142543310.3762/bjnano.8.452190-4286-8-45Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperatureTapas Ghosh0Biswarup Satpati1Surface Physics and Material Science Division, Saha Institute of Nuclear Physics, HBNI, 1/AF Bidhannagar, Kolkata-700064, IndiaSurface Physics and Material Science Division, Saha Institute of Nuclear Physics, HBNI, 1/AF Bidhannagar, Kolkata-700064, IndiaCopper nanoparticles have been deposited on silicon surfaces by a simple galvanic displacement reaction, and rapid thermal annealing has been performed under various atmospheric conditions. In spite of the general tendency of the agglomeration of nanoparticles to lower the surface energy at elevated temperatures, our plan-view and cross-sectional transmission electron microscopy (TEM), energy dispersive X-ray spectroscopy (EDX) and X-ray diffraction (XRD) analysis shows that the thermal oxidation of the copper nanoparticles and formation of cupric oxide (CuO) on silicon surfaces leads to wetting rather than agglomeration. In contrast, agglomeration has been observed when copper nanoparticles were annealed in a nitrogen environment. The lattice transformation from cubic Cu to monoclinic CuO, and hence the change in surface energy of the particles, assists the wetting process. The occurrence of wetting during the oxidation step implies a strong interaction between the oxidized film and the silicon surface.https://doi.org/10.3762/bjnano.8.45coppercupric oxideelectron diffractiongalvanic displacement reactionoxidationsurface wettingtransmission electron microscopy |
| spellingShingle | Tapas Ghosh Biswarup Satpati Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature Beilstein Journal of Nanotechnology copper cupric oxide electron diffraction galvanic displacement reaction oxidation surface wetting transmission electron microscopy |
| title | Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature |
| title_full | Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature |
| title_fullStr | Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature |
| title_full_unstemmed | Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature |
| title_short | Role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature |
| title_sort | role of oxygen in wetting of copper nanoparticles on silicon surfaces at elevated temperature |
| topic | copper cupric oxide electron diffraction galvanic displacement reaction oxidation surface wetting transmission electron microscopy |
| url | https://doi.org/10.3762/bjnano.8.45 |
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