Hybrid material integration for active photonic applications

Hybrid material integration for active photonic applications

The huge development of micro-/nano-manufacturing techniques on different materials has greatly expanded the possibilities of realizing on-chip multifunctional devices on photonic integrated circuits. In recent years, we have witnessed technological advancements, such as active photonic applications...

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Bibliographic Details
Main Authors: Chengyu Chen, Yuping Chen, Zhifan Fang, Rui Ge, Jiangwei Wu, Xianfeng Chen
Format: Article
Language:English
Published: AIP Publishing LLC 2024-03-01
Series:APL Photonics
Online Access:http://dx.doi.org/10.1063/5.0187924

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