Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite
Printed circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this...
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| Format: | Article |
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MDPI AG
2020-07-01
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| Series: | Applied Sciences |
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| Online Access: | https://www.mdpi.com/2076-3417/10/15/5197 |
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| author | Sufyan A. Azam Alex Fragoso |
| author_facet | Sufyan A. Azam Alex Fragoso |
| author_sort | Sufyan A. Azam |
| collection | DOAJ |
| description | Printed circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this paper, cantilever samples made of bare copper bounded to FR4 have been studied to analyze, for the first time, the vibration behavior of specimens with different aspect ratios, with and without central holes of different diameters. Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples with a very good correspondence between both methods. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties. |
| first_indexed | 2024-03-10T18:09:00Z |
| format | Article |
| id | doaj.art-583e1edbbfd540fbba06bb27aecf22c9 |
| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-03-10T18:09:00Z |
| publishDate | 2020-07-01 |
| publisher | MDPI AG |
| record_format | Article |
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| spelling | doaj.art-583e1edbbfd540fbba06bb27aecf22c92023-11-20T08:15:48ZengMDPI AGApplied Sciences2076-34172020-07-011015519710.3390/app10155197Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 CompositeSufyan A. Azam0Alex Fragoso1Department of Mechanical Engineering, Umm Al-Qura University, Makkah 21955, Saudi ArabiaDepartament d’Enginyeria Química, Universitat Rovira i Virgili, 43007 Tarragona, SpainPrinted circuit boards constitute the basis of most electronic devices and are mainly fabricated of thin copper films bounded to fiber epoxy laminates, such as FR4. Vibrational stress can induce device failure, and hence, studies addressing their modal properties have important applications. In this paper, cantilever samples made of bare copper bounded to FR4 have been studied to analyze, for the first time, the vibration behavior of specimens with different aspect ratios, with and without central holes of different diameters. Natural frequencies and damping ratios were determined experimentally and analytically using a finite element method for four groups of samples with a very good correspondence between both methods. The fundamental resonance frequency of all the specimens was found to be less than 40 Hz and the influence of a central hole was not significant to affect the modal properties.https://www.mdpi.com/2076-3417/10/15/5197modal analysisprinted circuit boardcopper/FR4 compositesize effect |
| spellingShingle | Sufyan A. Azam Alex Fragoso Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite Applied Sciences modal analysis printed circuit board copper/FR4 composite size effect |
| title | Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite |
| title_full | Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite |
| title_fullStr | Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite |
| title_full_unstemmed | Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite |
| title_short | Experimental and Numerical Simulation Study of the Vibration Properties of Thin Copper Films Bonded to FR4 Composite |
| title_sort | experimental and numerical simulation study of the vibration properties of thin copper films bonded to fr4 composite |
| topic | modal analysis printed circuit board copper/FR4 composite size effect |
| url | https://www.mdpi.com/2076-3417/10/15/5197 |
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