In Vivo Biocompatibility of Electrospun Biodegradable Dual Carrier (Antibiotic + Growth Factor) in a Mouse Model—Implications for Rapid Wound Healing

In Vivo Biocompatibility of Electrospun Biodegradable Dual Carrier (Antibiotic + Growth Factor) in a Mouse Model—Implications for Rapid Wound Healing

Tissue engineering technologies involving growth factors have produced one of the most advanced generations of diabetic wound healing solutions. Using this approach, a nanocomposite carrier was designed using Poly(<span style="font-variant: small-caps;">d</span>,<span style=...

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Bibliographic Details
Main Authors: Charu Dwivedi, Himanshu Pandey, Avinash C. Pandey, Sandip Patil, Pramod W. Ramteke, Peter Laux, Andreas Luch, Ajay Vikram Singh
Format: Article
Language:English
Published: MDPI AG 2019-04-01
Series:Pharmaceutics
Subjects:
tissue engineering
growth factor
diabetic
wound healing
nanocomposite
Online Access:https://www.mdpi.com/1999-4923/11/4/180

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