Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG)
Many hydrophobic metal coatings onto Aluminum have been studied in recent years because of their significant potential applications. Unfortunately, most of them lost the original metallic luster due to the micro/nano binary structures. In this paper, a facile method was developed to prepare a hydrop...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
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EDP Sciences
2018-01-01
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Series: | MATEC Web of Conferences |
Online Access: | https://doi.org/10.1051/matecconf/201821804026 |
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author | Budhi Susetyo Ferry Situmorang Evi M.H. Luthfiya Syifa Soegijono Bambang |
author_facet | Budhi Susetyo Ferry Situmorang Evi M.H. Luthfiya Syifa Soegijono Bambang |
author_sort | Budhi Susetyo Ferry |
collection | DOAJ |
description | Many hydrophobic metal coatings onto Aluminum have been studied in recent years because of their significant potential applications. Unfortunately, most of them lost the original metallic luster due to the micro/nano binary structures. In this paper, a facile method was developed to prepare a hydrophobic and high-glossy copper coating onto aluminum substrates. The wettability and gloss could be tuned by the value of current density. With the increase of current deensity, the surface roughness raised, thus resulting in increase of contact angle and decrease of glossiness. When the current density was less than 1 mA/cm2, the coating exhibited good luster and prefered orientation. Lowering the Current density the coating showed different corrossion resistance and good water reppelence. |
first_indexed | 2024-12-14T00:10:30Z |
format | Article |
id | doaj.art-592d745957a444d488139ead31b1d2b6 |
institution | Directory Open Access Journal |
issn | 2261-236X |
language | English |
last_indexed | 2024-12-14T00:10:30Z |
publishDate | 2018-01-01 |
publisher | EDP Sciences |
record_format | Article |
series | MATEC Web of Conferences |
spelling | doaj.art-592d745957a444d488139ead31b1d2b62022-12-21T23:25:46ZengEDP SciencesMATEC Web of Conferences2261-236X2018-01-012180402610.1051/matecconf/201821804026matecconf_iciee2018_04026Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG)Budhi Susetyo FerrySitumorang Evi M.H.Luthfiya SyifaSoegijono BambangMany hydrophobic metal coatings onto Aluminum have been studied in recent years because of their significant potential applications. Unfortunately, most of them lost the original metallic luster due to the micro/nano binary structures. In this paper, a facile method was developed to prepare a hydrophobic and high-glossy copper coating onto aluminum substrates. The wettability and gloss could be tuned by the value of current density. With the increase of current deensity, the surface roughness raised, thus resulting in increase of contact angle and decrease of glossiness. When the current density was less than 1 mA/cm2, the coating exhibited good luster and prefered orientation. Lowering the Current density the coating showed different corrossion resistance and good water reppelence.https://doi.org/10.1051/matecconf/201821804026 |
spellingShingle | Budhi Susetyo Ferry Situmorang Evi M.H. Luthfiya Syifa Soegijono Bambang Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG) MATEC Web of Conferences |
title | Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG) |
title_full | Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG) |
title_fullStr | Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG) |
title_full_unstemmed | Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG) |
title_short | Copper Electrodeposition onto Aluminum from a Copper Acid Baths In The Presence Of Poly Ethylene Glycol (PEG) |
title_sort | copper electrodeposition onto aluminum from a copper acid baths in the presence of poly ethylene glycol peg |
url | https://doi.org/10.1051/matecconf/201821804026 |
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