Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions
| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
American Chemical Society
2024-02-01
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| Series: | ACS Omega |
| Online Access: | https://doi.org/10.1021/acsomega.3c08950 |
| _version_ | 1797265178987855872 |
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| author | Cheng Zhang Zhe Xu Yingxuan Huang Yuefeng Li Yang Li Bobo Yang Rongrong Hu Jun Zou Changran Zheng Qi Qian |
| author_facet | Cheng Zhang Zhe Xu Yingxuan Huang Yuefeng Li Yang Li Bobo Yang Rongrong Hu Jun Zou Changran Zheng Qi Qian |
| author_sort | Cheng Zhang |
| collection | DOAJ |
| first_indexed | 2024-04-25T00:40:40Z |
| format | Article |
| id | doaj.art-5a3481bf3b9e4862bbf7692f67e1a7c0 |
| institution | Directory Open Access Journal |
| issn | 2470-1343 |
| language | English |
| last_indexed | 2024-04-25T00:40:40Z |
| publishDate | 2024-02-01 |
| publisher | American Chemical Society |
| record_format | Article |
| series | ACS Omega |
| spelling | doaj.art-5a3481bf3b9e4862bbf7692f67e1a7c02024-03-12T09:14:32ZengAmerican Chemical SocietyACS Omega2470-13432024-02-01910116371164510.1021/acsomega.3c08950Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing ConditionsCheng Zhang0Zhe Xu1Yingxuan Huang2Yuefeng Li3Yang Li4Bobo Yang5Rongrong Hu6Jun Zou7Changran Zheng8Qi Qian9School of Science, Shanghai Institute of Technology, Shanghai, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai, ChinaSchool of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai, ChinaSchool of Science, Shanghai Institute of Technology, Shanghai, ChinaAcademy for Engineering and Technology, Fudan University, Shanghai, ChinaZhejiang Silanex Technology (Taizhou) Co., Ltd., Taizhou, Zhejiang, Chinahttps://doi.org/10.1021/acsomega.3c08950 |
| spellingShingle | Cheng Zhang Zhe Xu Yingxuan Huang Yuefeng Li Yang Li Bobo Yang Rongrong Hu Jun Zou Changran Zheng Qi Qian Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions ACS Omega |
| title | Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions |
| title_full | Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions |
| title_fullStr | Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions |
| title_full_unstemmed | Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions |
| title_short | Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions |
| title_sort | study on thermomechanical properties and morphology of an epoxy resin thermally conductive adhesive under different curing conditions |
| url | https://doi.org/10.1021/acsomega.3c08950 |
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