Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions

Bibliographic Details
Main Authors: Cheng Zhang, Zhe Xu, Yingxuan Huang, Yuefeng Li, Yang Li, Bobo Yang, Rongrong Hu, Jun Zou, Changran Zheng, Qi Qian
Format: Article
Language:English
Published: American Chemical Society 2024-02-01
Series:ACS Omega
Online Access:https://doi.org/10.1021/acsomega.3c08950