Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions
Main Authors: | Cheng Zhang, Zhe Xu, Yingxuan Huang, Yuefeng Li, Yang Li, Bobo Yang, Rongrong Hu, Jun Zou, Changran Zheng, Qi Qian |
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Format: | Article |
Language: | English |
Published: |
American Chemical Society
2024-02-01
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Series: | ACS Omega |
Online Access: | https://doi.org/10.1021/acsomega.3c08950 |
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