Study of Through-Hole Micro-Drilling in Sapphire by Means of Pulsed Bessel Beams

Study of Through-Hole Micro-Drilling in Sapphire by Means of Pulsed Bessel Beams

Ultrashort Bessel beams have been used in this work to study the response of a 430-μm-thick monocrystalline sapphire sample to laser–matter interaction when injecting the beam orthogonally through the whole sample thickness. We show that with a 12° Bessel beam cone angle, we are able to internally m...

Full description

Bibliographic Details
Main Authors: Akhil Kuriakose, Monica Bollani, Paolo Di Trapani, Ottavia Jedrkiewicz
Format: Article
Language:English
Published: MDPI AG 2022-04-01
Series:Micromachines
Subjects:
laser micromachining
hole drilling
Bessel beams
sapphire
Online Access:https://www.mdpi.com/2072-666X/13/4/624

Similar Items

Similar Items