Study of Through-Hole Micro-Drilling in Sapphire by Means of Pulsed Bessel Beams
Ultrashort Bessel beams have been used in this work to study the response of a 430-μm-thick monocrystalline sapphire sample to laser–matter interaction when injecting the beam orthogonally through the whole sample thickness. We show that with a 12° Bessel beam cone angle, we are able to internally m...
| Hlavní autoři: | , , , |
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| Médium: | Článek |
| Jazyk: | English |
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MDPI AG
2022-04-01
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| Edice: | Micromachines |
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| On-line přístup: | https://www.mdpi.com/2072-666X/13/4/624 |