Thermal Face Verification through Identification
This paper reports on a new approach to face verification in long-wavelength infrared radiation. Two face images were combined into one double image, which was then used as an input for a classification based on neural networks. For testing, we exploited two external and one homemade thermal face da...
Main Authors: | , , |
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Format: | Article |
Language: | English |
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MDPI AG
2021-05-01
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Series: | Sensors |
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Online Access: | https://www.mdpi.com/1424-8220/21/9/3301 |
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author | Artur Grudzień Marcin Kowalski Norbert Pałka |
author_facet | Artur Grudzień Marcin Kowalski Norbert Pałka |
author_sort | Artur Grudzień |
collection | DOAJ |
description | This paper reports on a new approach to face verification in long-wavelength infrared radiation. Two face images were combined into one double image, which was then used as an input for a classification based on neural networks. For testing, we exploited two external and one homemade thermal face databases acquired in various variants. The method is reported to achieve a true acceptance rate of about 83%. We proved that the proposed method outperforms other studied baseline methods by about 20 percentage points. We also analyzed the issue of extending the performance of algorithms. We believe that the proposed double image method can also be applied to other spectral ranges and modalities different than the face. |
first_indexed | 2024-03-10T11:33:38Z |
format | Article |
id | doaj.art-5c1eaefbddf9451d8b8e35f62c79e1df |
institution | Directory Open Access Journal |
issn | 1424-8220 |
language | English |
last_indexed | 2024-03-10T11:33:38Z |
publishDate | 2021-05-01 |
publisher | MDPI AG |
record_format | Article |
series | Sensors |
spelling | doaj.art-5c1eaefbddf9451d8b8e35f62c79e1df2023-11-21T19:02:50ZengMDPI AGSensors1424-82202021-05-01219330110.3390/s21093301Thermal Face Verification through IdentificationArtur Grudzień0Marcin Kowalski1Norbert Pałka2Institute of Optoelectronics, Military University of Technology, 2 Gen. S. Kaliskiego St., 00-908 Warsaw, PolandInstitute of Optoelectronics, Military University of Technology, 2 Gen. S. Kaliskiego St., 00-908 Warsaw, PolandInstitute of Optoelectronics, Military University of Technology, 2 Gen. S. Kaliskiego St., 00-908 Warsaw, PolandThis paper reports on a new approach to face verification in long-wavelength infrared radiation. Two face images were combined into one double image, which was then used as an input for a classification based on neural networks. For testing, we exploited two external and one homemade thermal face databases acquired in various variants. The method is reported to achieve a true acceptance rate of about 83%. We proved that the proposed method outperforms other studied baseline methods by about 20 percentage points. We also analyzed the issue of extending the performance of algorithms. We believe that the proposed double image method can also be applied to other spectral ranges and modalities different than the face.https://www.mdpi.com/1424-8220/21/9/3301face verificationlong-wavelength infrared radiationconvolutional neural networks |
spellingShingle | Artur Grudzień Marcin Kowalski Norbert Pałka Thermal Face Verification through Identification Sensors face verification long-wavelength infrared radiation convolutional neural networks |
title | Thermal Face Verification through Identification |
title_full | Thermal Face Verification through Identification |
title_fullStr | Thermal Face Verification through Identification |
title_full_unstemmed | Thermal Face Verification through Identification |
title_short | Thermal Face Verification through Identification |
title_sort | thermal face verification through identification |
topic | face verification long-wavelength infrared radiation convolutional neural networks |
url | https://www.mdpi.com/1424-8220/21/9/3301 |
work_keys_str_mv | AT arturgrudzien thermalfaceverificationthroughidentification AT marcinkowalski thermalfaceverificationthroughidentification AT norbertpałka thermalfaceverificationthroughidentification |