Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of Silicon

Laser ablation of semiconductor silicon has been extensively studied in the past few decades. In the ultrashort pulse domain, whether in the fs scale or ps scale, the pulse energy fluence threshold in the ablation of silicon is strongly dependent on the pulse width. However, in the ns pulse scale, t...

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Main Authors: Shunping Li, Xinchang Wang, Guojie Chen, Zhongke Wang
Format: Article
Language:English
Published: MDPI AG 2022-12-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/14/1/119
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author Shunping Li
Xinchang Wang
Guojie Chen
Zhongke Wang
author_facet Shunping Li
Xinchang Wang
Guojie Chen
Zhongke Wang
author_sort Shunping Li
collection DOAJ
description Laser ablation of semiconductor silicon has been extensively studied in the past few decades. In the ultrashort pulse domain, whether in the fs scale or ps scale, the pulse energy fluence threshold in the ablation of silicon is strongly dependent on the pulse width. However, in the ns pulse scale, the energy fluence threshold dependence on the pulse width is not well understood. This study elucidates the interaction energy dependency on pulse width in ns NIR laser ablation of silicon. The level of ablation or melting was determined by the pulse energy deposition rate, which was proportional to laser peak power. Shorter pulse widths with high peak power were likely to induce surface ablation, while longer pulse widths were likely to induce surface melting. The ablation threshold increased from 5.63 to 24.84 J/cm<sup>2</sup> as the pulse width increased from 26 to 500 ns. The melting threshold increased from 3.33 to 5.76 J/cm<sup>2</sup> as the pulse width increased from 26 to 200 ns, and then remained constant until 500 ns, the longest width investigated. Distinct from a shorter pulse width, a longer pulse width did not require a higher power level for inducing surface melting, as surface melting can be induced at a lower power with the longer heating time of a longer pulse width. The line width from surface melting was less than the focused spot size; the line appeared either as a continuous line at slow scanning speed or as isolated dots at high scanning speed. In contrast, the line width from ablation significantly exceeded the focused spot size.
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spelling doaj.art-5c46244ca5ce41f49af9889f5807beb42023-11-30T23:33:28ZengMDPI AGMicromachines2072-666X2022-12-0114111910.3390/mi14010119Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of SiliconShunping Li0Xinchang Wang1Guojie Chen2Zhongke Wang3Guangdong-Hong Kong-Macao Intelligent Micro-Nano Optoelectronic Technology Joint Laboratory, School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528220, ChinaGuangdong-Hong Kong-Macao Intelligent Micro-Nano Optoelectronic Technology Joint Laboratory, School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528220, ChinaGuangdong-Hong Kong-Macao Intelligent Micro-Nano Optoelectronic Technology Joint Laboratory, School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528220, ChinaSingapore Institute of Manufacturing Technology (SIMTech), A*Star, 2 Fusionopolis Way, Singapore 138634, SingaporeLaser ablation of semiconductor silicon has been extensively studied in the past few decades. In the ultrashort pulse domain, whether in the fs scale or ps scale, the pulse energy fluence threshold in the ablation of silicon is strongly dependent on the pulse width. However, in the ns pulse scale, the energy fluence threshold dependence on the pulse width is not well understood. This study elucidates the interaction energy dependency on pulse width in ns NIR laser ablation of silicon. The level of ablation or melting was determined by the pulse energy deposition rate, which was proportional to laser peak power. Shorter pulse widths with high peak power were likely to induce surface ablation, while longer pulse widths were likely to induce surface melting. The ablation threshold increased from 5.63 to 24.84 J/cm<sup>2</sup> as the pulse width increased from 26 to 500 ns. The melting threshold increased from 3.33 to 5.76 J/cm<sup>2</sup> as the pulse width increased from 26 to 200 ns, and then remained constant until 500 ns, the longest width investigated. Distinct from a shorter pulse width, a longer pulse width did not require a higher power level for inducing surface melting, as surface melting can be induced at a lower power with the longer heating time of a longer pulse width. The line width from surface melting was less than the focused spot size; the line appeared either as a continuous line at slow scanning speed or as isolated dots at high scanning speed. In contrast, the line width from ablation significantly exceeded the focused spot size.https://www.mdpi.com/2072-666X/14/1/119silicon waferpulse widthlaser ablationablation thresholdsurface melting
spellingShingle Shunping Li
Xinchang Wang
Guojie Chen
Zhongke Wang
Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of Silicon
Micromachines
silicon wafer
pulse width
laser ablation
ablation threshold
surface melting
title Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of Silicon
title_full Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of Silicon
title_fullStr Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of Silicon
title_full_unstemmed Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of Silicon
title_short Interaction Energy Dependency on Pulse Width in ns NIR Laser Scanning of Silicon
title_sort interaction energy dependency on pulse width in ns nir laser scanning of silicon
topic silicon wafer
pulse width
laser ablation
ablation threshold
surface melting
url https://www.mdpi.com/2072-666X/14/1/119
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AT xinchangwang interactionenergydependencyonpulsewidthinnsnirlaserscanningofsilicon
AT guojiechen interactionenergydependencyonpulsewidthinnsnirlaserscanningofsilicon
AT zhongkewang interactionenergydependencyonpulsewidthinnsnirlaserscanningofsilicon