INFLUENCE OF ELECTROPHORETIC DEPOSITION PARAMETERS ON PORE SIZE DISTRIBUTION OF DOPED NANO ALUMINA PLATES

Doped nano alumina powders were successfully deposited as a thick film by electrophoretic deposition (EPD). A mixture of ethanol, cation salts of alumina dopants and iodine was used for dispersion system. Mg- Y- La- and Ce- salts add to ethanol and deposited with alumina powders on to substrate. The...

Full description

Bibliographic Details
Main Authors: Mostafa Milani, Seyed Mohammad Zahraee, Mirkazemi Seyed Mohammad
Format: Article
Language:English
Published: University of Chemistry and Technology, Prague 2016-10-01
Series:Ceramics-Silikáty
Subjects:
Online Access: http://www.ceramics-silikaty.cz/index.php?page=cs_detail_doi&id=597
Description
Summary:Doped nano alumina powders were successfully deposited as a thick film by electrophoretic deposition (EPD). A mixture of ethanol, cation salts of alumina dopants and iodine was used for dispersion system. Mg- Y- La- and Ce- salts add to ethanol and deposited with alumina powders on to substrate. The effects of suspension power loading, deposition time, electrode distance and applied potential simultaneously on density, pore size distribution and cell current density of alumina nanoparticles were examined. The weight of deposition increased with time and voltage increased and electrode distance decreased. In all applied voltages in higher suspension concentration, weight of deposition are sufficiently high but the density of the film are clearly better in low and high voltages than medium voltage. In constant suspension concentration with increasing in applied voltage, deposition rate increased and current decreased faster than medium voltage, which limits the homogeneous deposition forming and decreased density. Low applied voltages provided better pore size distribution and narrow and steep slope in middle of pore size distribution plot. High density samples with best pore size distribution achieved in lower rate deposition and assisted to better densification at sintering step in doped alumina plates.
ISSN:0862-5468
1804-5847