Study on Creep Damage in Sn<sub>60</sub>Pb<sub>40</sub> and Sn<sub>3.8</sub>Ag<sub>0.7</sub>Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana
A numerical study on the creep damage in soldered interconnects in c-Si solar photovoltaic cells has been conducted using equivalent creep strain, accumulated creep strain and accumulated creep energy density methods. The study used data from outdoor weathering of photovoltaic (PV) modules over a th...
Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-04-01
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Series: | Crystals |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4352/11/4/441 |