Study on Creep Damage in Sn<sub>60</sub>Pb<sub>40</sub> and Sn<sub>3.8</sub>Ag<sub>0.7</sub>Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana

Study on Creep Damage in Sn<sub>60</sub>Pb<sub>40</sub> and Sn<sub>3.8</sub>Ag<sub>0.7</sub>Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana

A numerical study on the creep damage in soldered interconnects in c-Si solar photovoltaic cells has been conducted using equivalent creep strain, accumulated creep strain and accumulated creep energy density methods. The study used data from outdoor weathering of photovoltaic (PV) modules over a th...

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Bibliographic Details
Main Authors: Frank Kwabena Afriyie Nyarko, Gabriel Takyi, Francis Boafo Effah
Format: Article
Language:English
Published: MDPI AG 2021-04-01
Series:Crystals
Subjects:
strain damage
interconnections
accumulated creep energy density
thermal cycles
Online Access:https://www.mdpi.com/2073-4352/11/4/441

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