The effect of pre-existing voids on solder reliability at different thermomechanical stress Levels: Experimental assessment
After lead-free technology, pre-existing voids in Power-MOSFET device solder connections have been a hot topic. Previous studies have examined the mechanical performance of solders with manufacturing-induced voids typically by generating excessive voids intentionally using simulation analysis withou...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-09-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127523006901 |