Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network Model

Due to the disparate timescale behavior in the electrical and thermal aspects, achieving a balance between simulation efficiency and accuracy in electrothermal analysis of insulated gate bipolar transistor (IGBT) modules has been a challenging task. A physical-based electrothermal stress evaluation...

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Main Authors: Yiping Lu, Enyao Xiang, Ankang Zhu, Hongyi Gao, Haoze Luo, Huan Yang, Rongxiang Zhao
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Open Journal of Power Electronics
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10214390/
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author Yiping Lu
Enyao Xiang
Ankang Zhu
Hongyi Gao
Haoze Luo
Huan Yang
Rongxiang Zhao
author_facet Yiping Lu
Enyao Xiang
Ankang Zhu
Hongyi Gao
Haoze Luo
Huan Yang
Rongxiang Zhao
author_sort Yiping Lu
collection DOAJ
description Due to the disparate timescale behavior in the electrical and thermal aspects, achieving a balance between simulation efficiency and accuracy in electrothermal analysis of insulated gate bipolar transistor (IGBT) modules has been a challenging task. A physical-based electrothermal stress evaluation approach combining with artificial neural network (ANN) model is proposed in this article, which significantly improves performance in circuit simulation. The training data for ANN models are derived from the Hefner physical model, a well-established model integrated in Saber. By re-expressing the Hefner model using MATLAB scripts, high-precision data can be efficiently obtained. Double-pulse experiments show that the switching transient characterized by the Hefner model have high precision, with an error within 5% compared to the experimental data. Additionally, the transient behavior of IGBT devices is further described by a two-layer feed-forward ANN, trained using datasets obtained by varying parasitic or operating parameters in the re-expressed Hefner model. Combining the physical model with the ANN models, the proposed approach can simulate not only transient electrical behavior but also long-term thermal behavior with accurate switching energy. This approach has been implemented in MATLAB/Simulink and verified with Saber for system-level circuit simulation. The electrothermal stress evaluation results show that the simulation efficiency is significantly improved (180 times faster than Saber under the simulation settings in this article), while maintaining high precision, and the error is within 2.5%. Experimental results also validate the accuracy of proposed model in predicting the voltage and current stress, with a maximum error of 1.5%.
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spelling doaj.art-5d369db798ff40e585dc7bf9c09c4ce42023-09-20T23:00:37ZengIEEEIEEE Open Journal of Power Electronics2644-13142023-01-01474075110.1109/OJPEL.2023.330401610214390Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network ModelYiping Lu0https://orcid.org/0000-0003-4241-1185Enyao Xiang1https://orcid.org/0009-0000-7431-5919Ankang Zhu2https://orcid.org/0000-0002-2837-4587Hongyi Gao3https://orcid.org/0009-0001-0716-0897Haoze Luo4https://orcid.org/0000-0001-5103-5068Huan Yang5https://orcid.org/0000-0001-5388-0687Rongxiang Zhao6Zhejiang Provincial Key Laboratory of Electrical Machine Systems and the College of Electrical Engineering, Zhejiang University, Hangzhou, ChinaZhejiang Provincial Key Laboratory of Electrical Machine Systems and the College of Electrical Engineering, Zhejiang University, Hangzhou, ChinaZJU-Hangzhou Global Scientific and Technological Innovation Center, Hangzhou, ChinaZJU-Hangzhou Global Scientific and Technological Innovation Center, Hangzhou, ChinaZJU-Hangzhou Global Scientific and Technological Innovation Center, Hangzhou, ChinaZhejiang Provincial Key Laboratory of Electrical Machine Systems and the College of Electrical Engineering, Zhejiang University, Hangzhou, ChinaZhejiang Provincial Key Laboratory of Electrical Machine Systems and the College of Electrical Engineering, Zhejiang University, Hangzhou, ChinaDue to the disparate timescale behavior in the electrical and thermal aspects, achieving a balance between simulation efficiency and accuracy in electrothermal analysis of insulated gate bipolar transistor (IGBT) modules has been a challenging task. A physical-based electrothermal stress evaluation approach combining with artificial neural network (ANN) model is proposed in this article, which significantly improves performance in circuit simulation. The training data for ANN models are derived from the Hefner physical model, a well-established model integrated in Saber. By re-expressing the Hefner model using MATLAB scripts, high-precision data can be efficiently obtained. Double-pulse experiments show that the switching transient characterized by the Hefner model have high precision, with an error within 5% compared to the experimental data. Additionally, the transient behavior of IGBT devices is further described by a two-layer feed-forward ANN, trained using datasets obtained by varying parasitic or operating parameters in the re-expressed Hefner model. Combining the physical model with the ANN models, the proposed approach can simulate not only transient electrical behavior but also long-term thermal behavior with accurate switching energy. This approach has been implemented in MATLAB/Simulink and verified with Saber for system-level circuit simulation. The electrothermal stress evaluation results show that the simulation efficiency is significantly improved (180 times faster than Saber under the simulation settings in this article), while maintaining high precision, and the error is within 2.5%. Experimental results also validate the accuracy of proposed model in predicting the voltage and current stress, with a maximum error of 1.5%.https://ieeexplore.ieee.org/document/10214390/Artificial neural network (ANN)electrothermal stressphysical modelinsulated gate bipolar transistor (IGBT)
spellingShingle Yiping Lu
Enyao Xiang
Ankang Zhu
Hongyi Gao
Haoze Luo
Huan Yang
Rongxiang Zhao
Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network Model
IEEE Open Journal of Power Electronics
Artificial neural network (ANN)
electrothermal stress
physical model
insulated gate bipolar transistor (IGBT)
title Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network Model
title_full Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network Model
title_fullStr Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network Model
title_full_unstemmed Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network Model
title_short Physics-Based Electrothermal Stress Evaluation Approach of IGBT Modules Combined With Artificial Neural Network Model
title_sort physics based electrothermal stress evaluation approach of igbt modules combined with artificial neural network model
topic Artificial neural network (ANN)
electrothermal stress
physical model
insulated gate bipolar transistor (IGBT)
url https://ieeexplore.ieee.org/document/10214390/
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AT ankangzhu physicsbasedelectrothermalstressevaluationapproachofigbtmodulescombinedwithartificialneuralnetworkmodel
AT hongyigao physicsbasedelectrothermalstressevaluationapproachofigbtmodulescombinedwithartificialneuralnetworkmodel
AT haozeluo physicsbasedelectrothermalstressevaluationapproachofigbtmodulescombinedwithartificialneuralnetworkmodel
AT huanyang physicsbasedelectrothermalstressevaluationapproachofigbtmodulescombinedwithartificialneuralnetworkmodel
AT rongxiangzhao physicsbasedelectrothermalstressevaluationapproachofigbtmodulescombinedwithartificialneuralnetworkmodel