Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications
Recently, nanosilver pastes have emerged as one of the most promising high temperature bonding materials for high frequency and high power applications, which provide an effective lead-free electronic packaging solution instead of high-lead and gold-based solders. Although nanosilver pastes can be s...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2018-07-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2072-666X/9/7/346 |
| _version_ | 1819179196361998336 |
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| author | Wei Liu Rong An Chunqing Wang Zhen Zheng Yanhong Tian Ronglin Xu Zhongtao Wang |
| author_facet | Wei Liu Rong An Chunqing Wang Zhen Zheng Yanhong Tian Ronglin Xu Zhongtao Wang |
| author_sort | Wei Liu |
| collection | DOAJ |
| description | Recently, nanosilver pastes have emerged as one of the most promising high temperature bonding materials for high frequency and high power applications, which provide an effective lead-free electronic packaging solution instead of high-lead and gold-based solders. Although nanosilver pastes can be sintered at lower temperature compared to bulk silver, applications of nanosilver pastes are limited by long-term sintering time (20–30 min), relative high sintering temperature (>250 °C), and applied external pressure, which may damage chips and electronic components. Therefore, low temperature rapid sintering processes that can obtain excellent nanosilver joints are anticipated. In this regard, we present a review of recent progress in the rapid sintering of nanosilver pastes. Preparation of nanosilver particles and pastes, mechanisms of nanopastes sintering, and different rapid sintering processes are discussed. Emphasis is placed on the properties of sintered joints obtained by different sintering processes such as electric current assisted sintering, spark plasma sintering, and laser sintering, etc. Although the research on rapid sintering processes for nanosilver pastes has made a great breakthrough over the past few decades, investigations on mechanisms of rapid sintering, and the performance of joints fabricated by pastes with different compositions and morphologies are still far from enough. |
| first_indexed | 2024-12-22T21:54:36Z |
| format | Article |
| id | doaj.art-5d735716ffc2403e92d6c3a36217e3d4 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-12-22T21:54:36Z |
| publishDate | 2018-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-5d735716ffc2403e92d6c3a36217e3d42022-12-21T18:11:16ZengMDPI AGMicromachines2072-666X2018-07-019734610.3390/mi9070346mi9070346Recent Progress in Rapid Sintering of Nanosilver for Electronics ApplicationsWei Liu0Rong An1Chunqing Wang2Zhen Zheng3Yanhong Tian4Ronglin Xu5Zhongtao Wang6State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, ChinaRecently, nanosilver pastes have emerged as one of the most promising high temperature bonding materials for high frequency and high power applications, which provide an effective lead-free electronic packaging solution instead of high-lead and gold-based solders. Although nanosilver pastes can be sintered at lower temperature compared to bulk silver, applications of nanosilver pastes are limited by long-term sintering time (20–30 min), relative high sintering temperature (>250 °C), and applied external pressure, which may damage chips and electronic components. Therefore, low temperature rapid sintering processes that can obtain excellent nanosilver joints are anticipated. In this regard, we present a review of recent progress in the rapid sintering of nanosilver pastes. Preparation of nanosilver particles and pastes, mechanisms of nanopastes sintering, and different rapid sintering processes are discussed. Emphasis is placed on the properties of sintered joints obtained by different sintering processes such as electric current assisted sintering, spark plasma sintering, and laser sintering, etc. Although the research on rapid sintering processes for nanosilver pastes has made a great breakthrough over the past few decades, investigations on mechanisms of rapid sintering, and the performance of joints fabricated by pastes with different compositions and morphologies are still far from enough.http://www.mdpi.com/2072-666X/9/7/346nanosilver pastesrapid sinteringspark plasma sinteringlaser sinteringelectric current assisted sintering |
| spellingShingle | Wei Liu Rong An Chunqing Wang Zhen Zheng Yanhong Tian Ronglin Xu Zhongtao Wang Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications Micromachines nanosilver pastes rapid sintering spark plasma sintering laser sintering electric current assisted sintering |
| title | Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications |
| title_full | Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications |
| title_fullStr | Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications |
| title_full_unstemmed | Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications |
| title_short | Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications |
| title_sort | recent progress in rapid sintering of nanosilver for electronics applications |
| topic | nanosilver pastes rapid sintering spark plasma sintering laser sintering electric current assisted sintering |
| url | http://www.mdpi.com/2072-666X/9/7/346 |
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