CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES
A simulation of the cooling of electronic devices was carried out by means of microchannels, using water as a coolant to dissipate the heat generated from a computer processor, and thus stabilize its optimum operating temperature. For the development of this study, computational fluid mechanics mode...
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| Format: | Article |
| Language: | English |
| Published: |
IIUM Press, International Islamic University Malaysia
2022-01-01
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| Series: | International Islamic University Malaysia Engineering Journal |
| Subjects: | |
| Online Access: | https://journals.iium.edu.my/ejournal/index.php/iiumej/article/view/2113 |
| _version_ | 1819237343139201024 |
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| author | Jonathan Fábregas Henry Santamaria Edgardo Buelvas Saul Perez Carlos Díaz Javier Carpintero Ricardo Mendoza Jennifer Villa |
| author_facet | Jonathan Fábregas Henry Santamaria Edgardo Buelvas Saul Perez Carlos Díaz Javier Carpintero Ricardo Mendoza Jennifer Villa |
| author_sort | Jonathan Fábregas |
| collection | DOAJ |
| description | A simulation of the cooling of electronic devices was carried out by means of microchannels, using water as a coolant to dissipate the heat generated from a computer processor, and thus stabilize its optimum operating temperature. For the development of this study, computational fluid mechanics modeling was established in order to determine the temperature profiles, pressure profiles, and velocity behavior of the working fluid in the microchannel. In the results of the study, the operating temperatures of the computer processor were obtained, in the ranges of 303 K to 307 K, with fluid velocities in the microchannels of 5 m/s, a pressure drop of 633.7 kPa, and a factor of safety of the design of the microchannel of 15. From the results, the improvement of the heat transfer in a cooling system of electronic devices was evidenced when using a coolant as a working fluid compared to the cooling by forced air flow traditional.
ABSTRAK: Simulasi penyejukan alatan elektronik telah dibina menggunakan saluran mikro, di samping air sebagai agen penyejuk bagi menghilangkan haba yang terhasil dari pemproses komputer, dan penstabil pada suhu operasi optimum. Kajian ini mengenai model komputasi mekanik bendalir bagi menentukan profil suhu, profil tekanan, dan halaju perubahan bendalir dalam saluran mikro. Dapatan kajian menunjukkan suhu operasi pemproses komputer adalah pada julat suhu 303 K sehingga 307 K, dengan halaju bendalir dalam saluran mikro adalah pada kelajuan 5 m/s, penurunan tekanan sebanyak 633.7 kPa, dan faktor keselamatan 15 bagi reka bentuk saluran mikro. Ini menunjukkan terdapat kenaikan pemindahan haba bagi sistem penyejukan alatan elektronik ini, terutama apabila cecair digunakan sebagai penyejuk haba berbanding kaedah tradisi iaitu dengan mengguna pakai aliran udara sebagai agen penyejuk. |
| first_indexed | 2024-12-23T13:18:49Z |
| format | Article |
| id | doaj.art-5d97a6c889c349219542d527f655a4cb |
| institution | Directory Open Access Journal |
| issn | 1511-788X 2289-7860 |
| language | English |
| last_indexed | 2024-12-23T13:18:49Z |
| publishDate | 2022-01-01 |
| publisher | IIUM Press, International Islamic University Malaysia |
| record_format | Article |
| series | International Islamic University Malaysia Engineering Journal |
| spelling | doaj.art-5d97a6c889c349219542d527f655a4cb2022-12-21T17:45:31ZengIIUM Press, International Islamic University MalaysiaInternational Islamic University Malaysia Engineering Journal1511-788X2289-78602022-01-0123110.31436/iiumej.v23i1.2113CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICESJonathan Fábregas0Henry Santamaria1Edgardo Buelvas2Saul Perez3Carlos Díaz4Javier Carpintero5Ricardo Mendoza6Jennifer Villa7Universidad Autónoma del CaribeUniversidad Autónoma del CaribeUniversidad Autónoma del CaribeUniversidad Autónoma del CaribeUniversidad Autónoma del CaribeUniversidad de la CostaUniversidad de la CostaUniversidad de la CostaA simulation of the cooling of electronic devices was carried out by means of microchannels, using water as a coolant to dissipate the heat generated from a computer processor, and thus stabilize its optimum operating temperature. For the development of this study, computational fluid mechanics modeling was established in order to determine the temperature profiles, pressure profiles, and velocity behavior of the working fluid in the microchannel. In the results of the study, the operating temperatures of the computer processor were obtained, in the ranges of 303 K to 307 K, with fluid velocities in the microchannels of 5 m/s, a pressure drop of 633.7 kPa, and a factor of safety of the design of the microchannel of 15. From the results, the improvement of the heat transfer in a cooling system of electronic devices was evidenced when using a coolant as a working fluid compared to the cooling by forced air flow traditional. ABSTRAK: Simulasi penyejukan alatan elektronik telah dibina menggunakan saluran mikro, di samping air sebagai agen penyejuk bagi menghilangkan haba yang terhasil dari pemproses komputer, dan penstabil pada suhu operasi optimum. Kajian ini mengenai model komputasi mekanik bendalir bagi menentukan profil suhu, profil tekanan, dan halaju perubahan bendalir dalam saluran mikro. Dapatan kajian menunjukkan suhu operasi pemproses komputer adalah pada julat suhu 303 K sehingga 307 K, dengan halaju bendalir dalam saluran mikro adalah pada kelajuan 5 m/s, penurunan tekanan sebanyak 633.7 kPa, dan faktor keselamatan 15 bagi reka bentuk saluran mikro. Ini menunjukkan terdapat kenaikan pemindahan haba bagi sistem penyejukan alatan elektronik ini, terutama apabila cecair digunakan sebagai penyejuk haba berbanding kaedah tradisi iaitu dengan mengguna pakai aliran udara sebagai agen penyejuk.https://journals.iium.edu.my/ejournal/index.php/iiumej/article/view/2113CFD (Computational Fluids Dynamicsmicrochannels (MC)processorcooling |
| spellingShingle | Jonathan Fábregas Henry Santamaria Edgardo Buelvas Saul Perez Carlos Díaz Javier Carpintero Ricardo Mendoza Jennifer Villa CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES International Islamic University Malaysia Engineering Journal CFD (Computational Fluids Dynamics microchannels (MC) processor cooling |
| title | CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES |
| title_full | CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES |
| title_fullStr | CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES |
| title_full_unstemmed | CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES |
| title_short | CFD MODELING OF MICROCHANNELS COOLING FOR ELECTRONIC MICRODEVICES |
| title_sort | cfd modeling of microchannels cooling for electronic microdevices |
| topic | CFD (Computational Fluids Dynamics microchannels (MC) processor cooling |
| url | https://journals.iium.edu.my/ejournal/index.php/iiumej/article/view/2113 |
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