Online characterization of ambient temperature influence on die swell behavior of rubber compound
In this study, the influence of the ambient temperature in the range of 20–60 °C on the die swell behavior of rubber compound were studied by a capillary rheometer with new designed external heating device. The results demonstrated that the die swell ratio (B) increased rapidly in the initial phase...
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Elsevier
2022-12-01
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Series: | Polymer Testing |
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Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941822003087 |
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author | Zhongjin Du Gerhard Ziegmann Hongying Zhao Shugao Zhao |
author_facet | Zhongjin Du Gerhard Ziegmann Hongying Zhao Shugao Zhao |
author_sort | Zhongjin Du |
collection | DOAJ |
description | In this study, the influence of the ambient temperature in the range of 20–60 °C on the die swell behavior of rubber compound were studied by a capillary rheometer with new designed external heating device. The results demonstrated that the die swell ratio (B) increased rapidly in the initial phase and reached a stable value after a certain time. The time dependence of B was then calculated based on the experimental data using Burger's model. In addition, it can be found that B was proportional to the ambient temperature of the extrudate, since the relaxation time decreased obviously with increasing ambient temperature. At the constant time of 130 min, B in the range of 20–60 °C were 1.393, 1.405, 1.420, 1.425 and 1.438 mm, respectively. Furthermore, an equation was established to describe the relationship among the B, test time and ambient temperature. The calculated value was consistent with experimental data, which was 1.447 and 1.449 mm, respectively. While the equation was not applicable when the ambient temperature lay above 70 °C due to the decreased interaction between rubber and carbon black. It was also found that the contraction effect played a significant role on the behavior of die swell. B of the extrudate under 60 °C and 70 °C was reduced by 1.5% and 1.2%, respectively. |
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format | Article |
id | doaj.art-5dfeb9b066dc4dcea97c403fe9784859 |
institution | Directory Open Access Journal |
issn | 0142-9418 |
language | English |
last_indexed | 2024-04-11T10:21:23Z |
publishDate | 2022-12-01 |
publisher | Elsevier |
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series | Polymer Testing |
spelling | doaj.art-5dfeb9b066dc4dcea97c403fe97848592022-12-22T04:29:44ZengElsevierPolymer Testing0142-94182022-12-01116107787Online characterization of ambient temperature influence on die swell behavior of rubber compoundZhongjin Du0Gerhard Ziegmann1Hongying Zhao2Shugao Zhao3Sino-German Institute for High Performance Materials and Technology, Qingdao University of Science and Technology, Qingdao, 266042, China; Institute of Polymer Materials and Plastics Engineering, TU Clausthal, Clausthal-Zellerfeld, 38678, GermanyInstitute of Polymer Materials and Plastics Engineering, TU Clausthal, Clausthal-Zellerfeld, 38678, GermanySino-German Institute for High Performance Materials and Technology, Qingdao University of Science and Technology, Qingdao, 266042, China; Chinese-German Faculty of Science and Technology, Qingdao University of Science and Technology, Qingdao, 266042, China; Corresponding author. Sino-German Institute for High Performance Materials and Technology, Qingdao University of Science and Technology, Qingdao, 266042, China.Sino-German Institute for High Performance Materials and Technology, Qingdao University of Science and Technology, Qingdao, 266042, China; Key Laboratory of Rubber-Plastics, Ministry of Education, Shandong Provincial Key Laboratory of Rubber-Plastics, Qingdao University of Science and Technology, Qingdao, 266042, ChinaIn this study, the influence of the ambient temperature in the range of 20–60 °C on the die swell behavior of rubber compound were studied by a capillary rheometer with new designed external heating device. The results demonstrated that the die swell ratio (B) increased rapidly in the initial phase and reached a stable value after a certain time. The time dependence of B was then calculated based on the experimental data using Burger's model. In addition, it can be found that B was proportional to the ambient temperature of the extrudate, since the relaxation time decreased obviously with increasing ambient temperature. At the constant time of 130 min, B in the range of 20–60 °C were 1.393, 1.405, 1.420, 1.425 and 1.438 mm, respectively. Furthermore, an equation was established to describe the relationship among the B, test time and ambient temperature. The calculated value was consistent with experimental data, which was 1.447 and 1.449 mm, respectively. While the equation was not applicable when the ambient temperature lay above 70 °C due to the decreased interaction between rubber and carbon black. It was also found that the contraction effect played a significant role on the behavior of die swell. B of the extrudate under 60 °C and 70 °C was reduced by 1.5% and 1.2%, respectively.http://www.sciencedirect.com/science/article/pii/S0142941822003087Rubber compoundDie swellAmbient temperatureOnline measurement |
spellingShingle | Zhongjin Du Gerhard Ziegmann Hongying Zhao Shugao Zhao Online characterization of ambient temperature influence on die swell behavior of rubber compound Polymer Testing Rubber compound Die swell Ambient temperature Online measurement |
title | Online characterization of ambient temperature influence on die swell behavior of rubber compound |
title_full | Online characterization of ambient temperature influence on die swell behavior of rubber compound |
title_fullStr | Online characterization of ambient temperature influence on die swell behavior of rubber compound |
title_full_unstemmed | Online characterization of ambient temperature influence on die swell behavior of rubber compound |
title_short | Online characterization of ambient temperature influence on die swell behavior of rubber compound |
title_sort | online characterization of ambient temperature influence on die swell behavior of rubber compound |
topic | Rubber compound Die swell Ambient temperature Online measurement |
url | http://www.sciencedirect.com/science/article/pii/S0142941822003087 |
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