The implementation of wideband 90° hybrids on non‐optimal substrates

Abstract A new technique to implement wideband 90° hybrid coupling profiles on non‐optimal substrate configurations is presented. The technique uses an impedance taper over the whole length of the hybrid to remove the restriction of a substrate defined maximum coupling coefficient at crossover, thus...

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Main Authors: Johan B. du Toit, Johan Joubert, Johann W. Odendaal
Format: Article
Language:English
Published: Wiley 2022-01-01
Series:Electronics Letters
Online Access:https://doi.org/10.1049/ell2.12355
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author Johan B. du Toit
Johan Joubert
Johann W. Odendaal
author_facet Johan B. du Toit
Johan Joubert
Johann W. Odendaal
author_sort Johan B. du Toit
collection DOAJ
description Abstract A new technique to implement wideband 90° hybrid coupling profiles on non‐optimal substrate configurations is presented. The technique uses an impedance taper over the whole length of the hybrid to remove the restriction of a substrate defined maximum coupling coefficient at crossover, thus resulting in much more flexibility for the implementation of hybrids on integrated printed circuit boards. The choice of board thicknesses and material type no longer needs to be dominated by the hybrid, but can be optimized for other components or priorities. The flexibility provided by the technique is shown in the implementation of a 2–18 GHz hybrid on a large range of substrate thicknesses as well as on a non‐optimal substrate material, for which acceptable measured performance is still obtained.
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spelling doaj.art-5ec745021fef49cd94a9679eb4a57e882022-12-21T23:55:49ZengWileyElectronics Letters0013-51941350-911X2022-01-01582555710.1049/ell2.12355The implementation of wideband 90° hybrids on non‐optimal substratesJohan B. du Toit0Johan Joubert1Johann W. Odendaal2Centre for Electromagnetism University of Pretoria Pretoria South AfricaCentre for Electromagnetism University of Pretoria Pretoria South AfricaCentre for Electromagnetism University of Pretoria Pretoria South AfricaAbstract A new technique to implement wideband 90° hybrid coupling profiles on non‐optimal substrate configurations is presented. The technique uses an impedance taper over the whole length of the hybrid to remove the restriction of a substrate defined maximum coupling coefficient at crossover, thus resulting in much more flexibility for the implementation of hybrids on integrated printed circuit boards. The choice of board thicknesses and material type no longer needs to be dominated by the hybrid, but can be optimized for other components or priorities. The flexibility provided by the technique is shown in the implementation of a 2–18 GHz hybrid on a large range of substrate thicknesses as well as on a non‐optimal substrate material, for which acceptable measured performance is still obtained.https://doi.org/10.1049/ell2.12355
spellingShingle Johan B. du Toit
Johan Joubert
Johann W. Odendaal
The implementation of wideband 90° hybrids on non‐optimal substrates
Electronics Letters
title The implementation of wideband 90° hybrids on non‐optimal substrates
title_full The implementation of wideband 90° hybrids on non‐optimal substrates
title_fullStr The implementation of wideband 90° hybrids on non‐optimal substrates
title_full_unstemmed The implementation of wideband 90° hybrids on non‐optimal substrates
title_short The implementation of wideband 90° hybrids on non‐optimal substrates
title_sort implementation of wideband 90° hybrids on non optimal substrates
url https://doi.org/10.1049/ell2.12355
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