Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit
Laser soldering is a crucial soldering technique in the realm of electronic assembly. The temperature of the solder joint is intimately connected with the quality of the solder. This paper introduces an adjustable power upper limit variable-structure Proportional–Integral–Derivative (PID) intelligen...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-08-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/14/8/1618 |
| _version_ | 1828715261425876992 |
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| author | Mingchao Li Pengbin Cao Cong Zhang Kuan Yan Yuquan Zhang |
| author_facet | Mingchao Li Pengbin Cao Cong Zhang Kuan Yan Yuquan Zhang |
| author_sort | Mingchao Li |
| collection | DOAJ |
| description | Laser soldering is a crucial soldering technique in the realm of electronic assembly. The temperature of the solder joint is intimately connected with the quality of the solder. This paper introduces an adjustable power upper limit variable-structure Proportional–Integral–Derivative (PID) intelligent control method for regulating the temperature of the solder joint during laser soldering. Distinct laser power limits are employed for workpieces with varying heat capacities. The solder joint temperature is monitored through an infrared thermometer, which enables closed-loop temperature control via a variable-structure PID algorithm. Residual neural network (ResNet) models are utilized to predict key soldering process parameters. This method has been executed and validated on a practical testing platform. Compared to other laser soldering control techniques, the proposed method demonstrates a low overshoot, rapid dynamic response, and swift adjustment capabilities, effectively enhancing the soldering quality and production efficiency. |
| first_indexed | 2024-03-10T23:43:34Z |
| format | Article |
| id | doaj.art-5ed10f4259934f968ecbc26247aba029 |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-10T23:43:34Z |
| publishDate | 2023-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-5ed10f4259934f968ecbc26247aba0292023-11-19T02:14:33ZengMDPI AGMicromachines2072-666X2023-08-01148161810.3390/mi14081618Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper LimitMingchao Li0Pengbin Cao1Cong Zhang2Kuan Yan3Yuquan Zhang4School of Mechanical and Electrical Engineering, Wuhan Institute of Technology, Wuhan 430205, ChinaSchool of Mechanical and Electrical Engineering, Wuhan Institute of Technology, Wuhan 430205, ChinaSchool of Mechanical and Electrical Engineering, Wuhan Institute of Technology, Wuhan 430205, ChinaSchool of Mechanical and Electrical Engineering, Wuhan Institute of Technology, Wuhan 430205, ChinaWuhan Fiberhome Technical Services Co., Ltd., Wuhan 430205, ChinaLaser soldering is a crucial soldering technique in the realm of electronic assembly. The temperature of the solder joint is intimately connected with the quality of the solder. This paper introduces an adjustable power upper limit variable-structure Proportional–Integral–Derivative (PID) intelligent control method for regulating the temperature of the solder joint during laser soldering. Distinct laser power limits are employed for workpieces with varying heat capacities. The solder joint temperature is monitored through an infrared thermometer, which enables closed-loop temperature control via a variable-structure PID algorithm. Residual neural network (ResNet) models are utilized to predict key soldering process parameters. This method has been executed and validated on a practical testing platform. Compared to other laser soldering control techniques, the proposed method demonstrates a low overshoot, rapid dynamic response, and swift adjustment capabilities, effectively enhancing the soldering quality and production efficiency.https://www.mdpi.com/2072-666X/14/8/1618laser solderingelectronic assemblysolder joint temperatureadjustable power upper limitvariable-structure PIDparameter optimization |
| spellingShingle | Mingchao Li Pengbin Cao Cong Zhang Kuan Yan Yuquan Zhang Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit Micromachines laser soldering electronic assembly solder joint temperature adjustable power upper limit variable-structure PID parameter optimization |
| title | Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit |
| title_full | Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit |
| title_fullStr | Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit |
| title_full_unstemmed | Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit |
| title_short | Variable-Structure Proportional–Integral–Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit |
| title_sort | variable structure proportional integral derivative laser solder joint temperature intelligent control method with adjustable power upper limit |
| topic | laser soldering electronic assembly solder joint temperature adjustable power upper limit variable-structure PID parameter optimization |
| url | https://www.mdpi.com/2072-666X/14/8/1618 |
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