Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method
Additive manufacturing (AM) is a free-form technology that shows great potential in the integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature, high conductivity and high resolution remain...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
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IOP Publishing
2023-01-01
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| Series: | International Journal of Extreme Manufacturing |
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| Online Access: | https://doi.org/10.1088/2631-7990/acd826 |
| _version_ | 1797814207272452096 |
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| author | Liexin Wu Li Meng Yueyue Wang Ming Lv Taoyuan Ouyang Yilin Wang Xiaoyan Zeng |
| author_facet | Liexin Wu Li Meng Yueyue Wang Ming Lv Taoyuan Ouyang Yilin Wang Xiaoyan Zeng |
| author_sort | Liexin Wu |
| collection | DOAJ |
| description | Additive manufacturing (AM) is a free-form technology that shows great potential in the integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature, high conductivity and high resolution remains a challenge. In this paper, a hybrid AM method combining the fused deposition modeling (FDM) and hydrophobic treatment assisted laser activation metallization (LAM) was proposed for manufacturing the polyetheretherketone (PEEK)-based 3D electronics, by which the conformal copper patterns were deposited on the 3D-printed PEEK parts, and the adhesion between them reached the 5B high level. Moreover, the 3D components could support the thermal cycling test from −55 °C to 125 °C for more than 100 cycles. Particularly, the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface, not affected by the inevitable printing borders and pores in the FDM-printed parts, then making the resolution of the electroless plated copper lines improved significantly. In consequence, Cu lines with width and spacing of only 60 µ m and 100 µ m were obtained on both as-printed and after-polished PEEK substrates. Finally, the potential of this technique to fabricate 3D conformal electronics was demonstrated. |
| first_indexed | 2024-03-13T08:04:11Z |
| format | Article |
| id | doaj.art-607aafe38b994eed919c8a8017891d36 |
| institution | Directory Open Access Journal |
| issn | 2631-7990 |
| language | English |
| last_indexed | 2024-03-13T08:04:11Z |
| publishDate | 2023-01-01 |
| publisher | IOP Publishing |
| record_format | Article |
| series | International Journal of Extreme Manufacturing |
| spelling | doaj.art-607aafe38b994eed919c8a8017891d362023-06-01T08:33:31ZengIOP PublishingInternational Journal of Extreme Manufacturing2631-79902023-01-015303500310.1088/2631-7990/acd826Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing methodLiexin Wu0Li Meng1https://orcid.org/0000-0002-8152-8901Yueyue Wang2Ming Lv3Taoyuan Ouyang4Yilin Wang5Xiaoyan Zeng6Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology , Wuhan 430074, People’s Republic of ChinaWuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology , Wuhan 430074, People’s Republic of ChinaWuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology , Wuhan 430074, People’s Republic of ChinaWuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology , Wuhan 430074, People’s Republic of ChinaWuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology , Wuhan 430074, People’s Republic of ChinaWuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology , Wuhan 430074, People’s Republic of ChinaWuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology , Wuhan 430074, People’s Republic of ChinaAdditive manufacturing (AM) is a free-form technology that shows great potential in the integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D conformal circuits that fulfill the requirements of high service temperature, high conductivity and high resolution remains a challenge. In this paper, a hybrid AM method combining the fused deposition modeling (FDM) and hydrophobic treatment assisted laser activation metallization (LAM) was proposed for manufacturing the polyetheretherketone (PEEK)-based 3D electronics, by which the conformal copper patterns were deposited on the 3D-printed PEEK parts, and the adhesion between them reached the 5B high level. Moreover, the 3D components could support the thermal cycling test from −55 °C to 125 °C for more than 100 cycles. Particularly, the application of a hydrophobic coating on the FDM-printed PEEK before LAM can promote an ideal catalytic selectivity on its surface, not affected by the inevitable printing borders and pores in the FDM-printed parts, then making the resolution of the electroless plated copper lines improved significantly. In consequence, Cu lines with width and spacing of only 60 µ m and 100 µ m were obtained on both as-printed and after-polished PEEK substrates. Finally, the potential of this technique to fabricate 3D conformal electronics was demonstrated.https://doi.org/10.1088/2631-7990/acd826PEEKfused deposition modelinghydrophobic treatmentlaser activation metallizationintegrated manufacturing of 3D electronicsresolution |
| spellingShingle | Liexin Wu Li Meng Yueyue Wang Ming Lv Taoyuan Ouyang Yilin Wang Xiaoyan Zeng Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method International Journal of Extreme Manufacturing PEEK fused deposition modeling hydrophobic treatment laser activation metallization integrated manufacturing of 3D electronics resolution |
| title | Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method |
| title_full | Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method |
| title_fullStr | Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method |
| title_full_unstemmed | Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method |
| title_short | Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method |
| title_sort | fabrication of polyetheretherketone peek based 3d electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method |
| topic | PEEK fused deposition modeling hydrophobic treatment laser activation metallization integrated manufacturing of 3D electronics resolution |
| url | https://doi.org/10.1088/2631-7990/acd826 |
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