Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics
Stretchable electronics, overcoming mismatch between rigid circuit and soft biology and withstanding overstretching before electrical/mechanical failure, enables attractive and prominent applications which are impossible for conventional electronics. Transfer printing and strain isolation techniques...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2022-05-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127522002234 |
| _version_ | 1828747933355343872 |
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| author | Di Guo Yan Li Qing Zhao Pai Liu Lixuan Che Zhan Kang Ming Li Yangjun Luo |
| author_facet | Di Guo Yan Li Qing Zhao Pai Liu Lixuan Che Zhan Kang Ming Li Yangjun Luo |
| author_sort | Di Guo |
| collection | DOAJ |
| description | Stretchable electronics, overcoming mismatch between rigid circuit and soft biology and withstanding overstretching before electrical/mechanical failure, enables attractive and prominent applications which are impossible for conventional electronics. Transfer printing and strain isolation techniques play important roles in fabricating and using of stretchable electronics. In this manuscript, driven by stiffness modulation and topology optimization, an easy-to-implement, reversible and scalable transfer printing with programmable adhesion switchability through only mechanical stimulus, and a strain isolation significantly reducing strain and effectively shielding active electronics from extreme elongation are proposed. The related performance and mechanism are respectively investigated through physical experiment and theoretical model. This study can be exploited as design guideline for stretchable electronics. |
| first_indexed | 2024-04-14T04:52:10Z |
| format | Article |
| id | doaj.art-60f2934130bc4efe9c989f5c299843f5 |
| institution | Directory Open Access Journal |
| issn | 0264-1275 |
| language | English |
| last_indexed | 2024-04-14T04:52:10Z |
| publishDate | 2022-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj.art-60f2934130bc4efe9c989f5c299843f52022-12-22T02:11:16ZengElsevierMaterials & Design0264-12752022-05-01217110602Stiffness modulation-driven transfer printing and strain isolation in stretchable electronicsDi Guo0Yan Li1Qing Zhao2Pai Liu3Lixuan Che4Zhan Kang5Ming Li6Yangjun Luo7State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, ChinaSchool of Aeronautics and Astronautics, Dalian University of Technology, Dalian 116024, ChinaState Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, ChinaSchool of Aeronautics and Astronautics, Dalian University of Technology, Dalian 116024, ChinaState Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, ChinaState Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China; International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, ChinaState Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China; Corresponding authors at: State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China (M. Li and Y. Luo).State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China; School of Aeronautics and Astronautics, Dalian University of Technology, Dalian 116024, China; Corresponding authors at: State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China (M. Li and Y. Luo).Stretchable electronics, overcoming mismatch between rigid circuit and soft biology and withstanding overstretching before electrical/mechanical failure, enables attractive and prominent applications which are impossible for conventional electronics. Transfer printing and strain isolation techniques play important roles in fabricating and using of stretchable electronics. In this manuscript, driven by stiffness modulation and topology optimization, an easy-to-implement, reversible and scalable transfer printing with programmable adhesion switchability through only mechanical stimulus, and a strain isolation significantly reducing strain and effectively shielding active electronics from extreme elongation are proposed. The related performance and mechanism are respectively investigated through physical experiment and theoretical model. This study can be exploited as design guideline for stretchable electronics.http://www.sciencedirect.com/science/article/pii/S0264127522002234Stretchable electronicsTransfer printingStrain isolationTopology optimizationStiffness modulation |
| spellingShingle | Di Guo Yan Li Qing Zhao Pai Liu Lixuan Che Zhan Kang Ming Li Yangjun Luo Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics Materials & Design Stretchable electronics Transfer printing Strain isolation Topology optimization Stiffness modulation |
| title | Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics |
| title_full | Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics |
| title_fullStr | Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics |
| title_full_unstemmed | Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics |
| title_short | Stiffness modulation-driven transfer printing and strain isolation in stretchable electronics |
| title_sort | stiffness modulation driven transfer printing and strain isolation in stretchable electronics |
| topic | Stretchable electronics Transfer printing Strain isolation Topology optimization Stiffness modulation |
| url | http://www.sciencedirect.com/science/article/pii/S0264127522002234 |
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